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OEM 4 Layer Circuit Board ENIG PCB Material FR4 1oz Plating Gold 30u”

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OEM 4 Layer Circuit Board ENIG PCB Material FR4 1oz Plating Gold 30u”

Country/Region china
City & Province shenzhen guangdong
Categories Other Electronic Components
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Product Details

Layer 4L FR4+Isola High Frequency PCB _1.6mm_ENIG 1oz Plating gold 30u”

 

HFPs are composed of complex material layers that are optimized for high-frequency performance. The material layers of an HFP must be carefully selected and combined to ensure optimal performance. Each layer is essential for the proper functioning of the PCB and its performance.

Layers4L
MaterialFR4+Isola
Board thickness1.6mm
Copper thickness1oz
Surface treatmnetENIG+Plating gold 30u”

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