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Solderless Testing Round Hole 830 Breadboard Prototyping With 2 Buses

CIXI ZHONGYI ELECTRONIC EQUIPMENT FACTORY
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CIXI ZHONGYI ELECTRONIC EQUIPMENT FACTORY

Solderless Testing Round Hole 830 Breadboard Prototyping With 2 Buses

Country/Region china
City & Province zhejiang
Categories Tool Processing Services
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Product Details

Solderless Testing Round Hole Breadboard Prototyping With 2 Buses

 

 

 

 

 Features:

 

  •  830 Point Solderless Breadboard  
  • Condition: NEW, 100% Good Quality  
  • Dimension: 16.6 x 5.4 x 0.85cm  
  • Tie Points: 830 Tie Points consists of: 630 Tie-Point Terminal Strip, 200 Tie-Point Distribution Strips  
  • Wire size: Suitabe for 29-20 AWG wires  
  • Apply to  breadboard   Input voltage: 6.5-12 V (DC) or USB power supply  
  • Output voltage: 3.3V/5V can switch over  
  • Maximum output current: <700 ma  
  • Fluctuation two road independent control, can switch over to 0 V, 3.3 V, 5 V  
  • On-board two groups of 3.3V, 5V DC output plug pin, convenient external lead use.

 

 

Competitive Advantage:

  • Convenient & Friendly Customer Service
  • Low Prices Direct From Factory Suppliers
  • Fast Delivery Around the World. 
  • High Quality With Global Standards. 
  • Safe Shipping Way and Payment

 

 

More Information:

 

 

Item NumberZY-1102
1Terminal StripTie-point 630
2Distribution StripsTie-point 200
HoleRound
Product Size16.6*5.4*0.85(cm)
ColorPink, white,yellow, blue, transparent
PackageBlister card

 

 

 

 

 

Product Image:

 

 

 

 

 

 

 

 

 

 

    

 

 

 

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