80mm Diamond Grinding Wheels Concrete Cements Stone Polishing

80-150mm High Performance Diamond Grinding Wheels Large Segments

Special For Concrete Cements And Stone Polishing

Diamond Grinding Wheel / Diamond Polishing Wheel 

Diamond Grinding Wafer / Diamond Polishing Wafer

Large Segments Grinding Blocks

Blade Type: RTM-TCD-018

Image Sample Specification:

80*20mm / 150*22.23mm (Diameter x Hole) , Bowl Shape

Processing Applications of Diamond Polishing Wafer: 

• Suitable for Grinding Surface of Concrete, cements and Stone Material.

• Suitable for both dry and wet polishing.

Main Features of Diamond Polishing Wheel:

• Fast Speed

• Smooth Cutting

• Not Easy To Break

• Long Service Life

• Low cost

Different sizes and types availbale here:

• Different cols can be chosen  (Yellow, green, pink, red, blue, golden, silver and black col.)

• Different Diameters supplied ( 80mm, 90mm, 100mm, 120mm, 125mm, 150mm, 180mm)

• Different Shapes of Grinding Blocks.(Large segments in turbo, wide ripple, single groove, double groove etc)

Our company can customize all kinds of products according to customers' needs, and establish detailed customer files to ensure customers' needs. Our company will strictly abide by this commitment and related contracts, fulfill the responsibilities and obligations!

Features of Diamond Grinding Wafer:

• Excellent grinding ability and high wear resistance ensure long service life of the grinding wheel.

• The high hardness of the binder makes the blade have the characteristics of high rigidity, so that the wheel will not deform in the grinding process.

• Through the fine adjustment of abrasive concentration and particle size, it can meet the requirements of grinding surface finish and has good grinding efficiency.

• Advanced and scientific processing means and strict process control ensure the high accuracy of wheel shape and position.

• The accurate classification of binders can meet the requirements of selecting special grinding wheel for processing different materials.

• Low cost grinding wafer to save money for large quantity preocessing.

More Pictures of Diamond Polishing Wheel:

Brief Introduction of Different Bonded Type of Diamond Blades:

• Resin bonded diamond series: resin bonded diamond and cubic boron nitride grinding wheels are abrasive tools and tools of various shapes made of diamond or cubic boron nitride and resin bonded.

         Features: high grinding efficiency, less heat, good self sharpening, not easy to block. The surface roughness of                       machined workpiece is low. Such as glass, ceramic.

         Applications: widely used in cemented carbide fine grinding, semi fine grinding, grinding, polishing, porcelain,

         stone and other non-metallic materials fine grinding.

• Diamond bronze bond series: it is an abrasive tool and tool made by pressing and high temperature sintering with diamond or cubic boron nitride as abrasive and metal powder as bond.

         Features: strong binding force, good wear resistance, long service life, good shape retention, can withstand heavy load

         grinding.

         Application: mainly used for grinding and cutting of glass, gem, stone, semiconductor material, brake pad, and                     electrolytic grinding of cemented carbide. 

• Ceramic bonded diamond grinding wheel series:

         Features: 1. High edge strength, i.e. high grinding efficiency and good self sharpening of grinding wheel;

         2. Good shape retention; 3. Easy correction; 4. High durability and long service life of grinding wheel; 5. High quality

         of knife edge.

        Purpose: it is mainly used for fast, high efficiency and low loss grinding of PCD, PCBN, cemented carbide tools and

        other cutting tools.

• Diamond / resin cutting chip series:

         Diamond cutting chip: mainly used for optical glass, gem, crystal, ceramics, marble, cemented carbide, tungsten

         steel, ferrite, semiconductor, etc.

         Diamond resin cutting chip: mainly used for glass, glass tube / plate, gem, crystal, ceramics, cemented carbide,

         tungsten steel, ferrite, monocrystalline silicon / polycrystalline silicon, silicon rod, semiconductor, etc

Precautions for use:

• Please check carefully before installing the cutting wheel. If there is any gap or other damage, please stop using it.

• When the cutting wheel is marked with the rotation direction, it should be consistent with the rotation direction of the machine tool. On the contrary, the cutting is not sharp, and it is difficult to give full play to the performance of the cutting wheel.

• Please do not use the cutting wheel that does not meet the requirements.

• If any abnormality is found in the cutting process, stop the machine immediately and check the cause.

• When the cutting is not sharp, the grinding wheel should be trimmed. If it is used continuously, the grinding wheel may be damaged due to overheating and overload.

• When the grinding wheel rotates, it is strictly forbidden to cut by hand, let alone touch the sand by hand and body

• The cutting wheel is forbidden to be used in operations other than grooving or cutting, so as to avoid abnormal operation due to uneven stress.

Ordering instructions:

When you order for the first time, please provide the following parameters, so that we can help you choose the most suitable cutting wheel.

Specification and size: abrasive, particle size, binder, outer diameter, thickness, inner diameter, abrasive working layer width, substrate thickness, etc. purpose: workpiece name, cutting size, cutting material;

Service conditions of grooving and cutting: machine tool, grinding wheel speed, feed speed and cutting depth;

Dry and wet cutting requirements: cutting accuracy, chipping requirements, processing surface integrity, etc

Special requirements: whether the tool is assembled and used, whether the resin cutting wheel needs to conduct electricity, whether the outer circle of the cutting wheel has a water tank, the size and quantity of the water tank, whether there is a chip removal groove on the outer side of the cutting wheel base, etc.

Order Operating Procedure: