Steel Body Diamond Grinding Wheel Back & Front Rough And Finish Grinding

Back Grinding Wheel Silicon Wafer Back & Front Rough and Finish Grinding

Hongtuo, as a major designer, manufacturer and distributor of diamond and CBN grinding wheels, can offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used on different grinding machines made in Europe,America,Japan, and China. They also feature a stable performance and a high cost effectiveness.

Silicon Wafer Back Grinding Wheel

This abrasive wheel is primarily used for thinning and finishing semiconductor wafers. It comes with a superior grinding performance and a low coast. It can be used on grinding machines manufactured in Japan,Germany and China.

Grinding Objects: Discrete devices, IC substrate silicon wafers and original silicon wafers

Processes: Back to front rough and fine grinding

Application: Semiconductor silicon, Wafer Back & Front Rough and Finish Grinding.

Work Piece Materials: Monocrystalline silicon and other semiconductor materials.