Active Member
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[China]
Address: 28-4#, China Germany Park, Xuedian Town, Xinzheng City
Contact name:Kevin
Xinzheng Dia Abrasives Co.,Ltd |
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The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.
Features:
Specification:
| Specifications: | Application | |||||||
| Common Shape | Wheel Size | Grit Size | Classic Specification | Industry | Workpiece&Material | Machine | Bond | Working Data |
| 6A2, 6A2T, 1A1 | OD: 175,195,209,305,255,355 | Coarse Grit: 270--800 Finish Grit: 2000--8000 | 6A2 175D 30T 76H 6A2 200D 35T 76H 6A2T 280D 30T 228.6H 1A1 40D 5T 18.7H | Semiconductor industry | Sapphire, silicon wafer | SHUWA, NTS, WEC, GALAXY. SPEEDFAM DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER | Vitrified Metal | |
