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Saw Grade Lithium Tantalate LiTaO3 Substrates

ANHUI CRYSTRO CRYSTAL MATERIALS Co., Ltd.

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Saw Grade Lithium Tantalate LiTaO3 Substrates

Country/Region china
Categories Bromide
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Product Details

SAW Grade LiTaO3 Crystal Substrates Growth Manufacturer

 

Lithium tantalate (LiTaO3) is a perovskite which possesses unique optical, piezoelectric and pyroelectric properties which make it valuable for nonlinear optics, passive infrared sensorssuch as motion detectors, terahertz generation and detection, surface acoustic waveapplications, cell phones and possibly pyroelectric nuclear fusion. Considerable information is available from commercial sources about this salt.

Note: Other sizes and coatings are available upon request.

 

 

Typical product sizes available

 

Bulk crystals:

up to 4 inch diameter and 50 mm thick

 

Crystal substrates / wafers (single side or double side polished)

10 x 10 x 0.5 mm
2 inch diameter x 0.5mm thick
4 inch diameter x 0.5mm thick

.

Crystal orientations available: Z-cut, X-cut, Y-cut

 

Crystro's LiTaO3 lithium tantalate crystal has >99.99% purity. Find high-quality lithium tantalate bulk crystals, wafers and substrates

 
 

Basic Properties of LiTaO3:

 

Crystal StructureTrigonal, Space group R3c, Point group 3m
Cell Parametersa=5.154Å,c=13.781Å
Melting Point1650
Curie Temperature607
Mohs Hardness5.5
Density7.46g/cm3
Dielectric Constantsε110:51.7
ε330:44.5
Elastic Stiffness CoefficientsCE11:2.33(×1011N/m2)
CE33:2.77(×1011N/m2)
Piezoelectric Strain Constantsd22:2.4(×10-11C/N)
d33:0.8(×10-11C/N)
Transmission range400-4500nm
Electro-optical coefficientsr33=30.4pm/V
Refractive index at 632.8nmno=2.176,ne=2.180

 


Typical Specifications

SpecificationsBouleWafer
DiameterΦ3''Φ4''Φ3''Φ4''
Length or Thickness (mm)≤100≤500.35-0.5
Orientation127.86°Y,64°Y,135°Y,X,Y,Z, and other cut
Ref.Flat OrientationX,Y
Ref.Flat Length22±2mm32±2mm22±2mm32±2mm
Front Side polishing/Mirror polished 5-15 Å
Back Side Lapping/0.3-1.0μm
Flatness (μm)/≤15
Bow (μm)/≤25

 

Crystro can offer other size and specification of wafers upon request.


 

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