Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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TC600 Microwave PCB with 15mil 20mil 30mil 50mil 60mil Thickness TC600 High Frequency PCB with Immersion Silver
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
Rogers' (Arlon) TC600 is a woven fiberglass reinforced, enhanced thermal conductivity ceramic filled, PTFE-based composite. It is designed to provide enhanced heat-transfer through“Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. The increased thermal conductivity (1.1 W/mk) provides higher power handling, reduces hot-spots and improves device reliability. Lower losses result in higher amplifier and antenna gains/efficiencies. Stable dielectric constant is across a wide temperature range (-75 ppm/oC -40°C to 140°C). It helps power amplifier and antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. It has low Z-Direction CTE and mechanical robustness is also greatly improved for the 6.15 dielectric constant market.
Features
1. Very Low Loss Tangent (0.002 at 10 GHz) provides Higher Amplifier or Antenna Efficiency
2. Mechanically Robustness improves processing and reliability, replaces brittle laminates that cannot withstand processing, impact or High Gain forces
3. Low coefficient of thermal expansion on X,Y and Z axis (9, 9 and 35 ppm/°C) matches active components for low stress solder joints
4. High Peel Strength for Reliable narrow lines
Benefits
1. Reduced Heat Generated through Transmission Line Loss
2. Heat Dissipation and Management
3. Replace Ceramic in Some Applications
4. Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs
Our PCB Capability (TC600)
| PCB Material: | Ceramic Filled PTFE/Woven Fiberglass |
| Designation: | TC600 |
| Dielectric constant: | 6.15 (10 GHz) |
| Dissipation Factor | 0.002 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Typical Applications:
1. Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
2. GPS & Hand-held RFID Reader Antennas
3. Microwave Combiner and Power Divider Boards in Avionics Applications
4. Power Amplifiers, Filters and Couplers
5. Small Footprint Antennas
Appendix: Typical Properties TC600
| Property | Unit | Value | Test Method |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1.8 MHz | - | 6.15 | Resonant Cavity |
| @10 GHz | - | 6.15 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @1.8 GHz | - | 0.0017 | Resonant Cavity |
| @10 GHz | - | 0.002 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | - | ||
| TCεr @ 10 GHz (-40-150°C) | ppm/ºC | -75 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 1.6x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 2.4x108 | IPC TM-650 2.5.17.1 |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 3.1x109 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 9.0x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 850 (34) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 62 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2. Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | °C | 512 | IPC TM-650 2.4.24.6 |
| 5% | °C | 572 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 9, 9 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 35 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.5 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | 10 (1.8) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 10 (1.8) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | 280 (1930) | IPC TM-650 2.4.18.3 |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 9.60/9.30 (66/64) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 5.0/4.30 (34/30) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
| Poisson’s Ratio | - | ASTM D-3039 | |
| 4. Physical Properties | |||
| Water Absorption | % | 0.02 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.9 | ASTM D792 Method A |
| Thermal Conductivity (z-axis) | W/mK | 1.1 | ASTM E1461 |
| Thermal Conductivity (x, y) | W/mK | 1.4 | ASTM E1461 |
| Specific Heat | J/gK | 0.94 | ASTM E1461 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10-6 torr | |||
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0 | NASA SP-R-0022A |
