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High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

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Shenzhen Bicheng Electronics Technology Co., Ltd

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

Country/Region china
City & Province shenzhen guangdong
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Product Details

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.

 

Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications

 

 

PCB Parameters

ItemDescriptionRequirementActualResult
1. LaminateMaterial TypeFR-4 IT-180ATCFR-4 IT-180ATCACC
Tg170℃170℃ACC
SupplierITEQITEQACC
Thickness1.6±10% mm1.63-1.68mmACC
2.Plating thicknessHole Wall≥25µm26.51µmACC
Outer copper35µm41.09µmACC
Inner Copper   
3.Solder maskMaterial TypeTAIYO/ PSR-2000GT600DTAIYO/ PSR-2000GT600DACC
ColorGreenGreenACC
Rigidity (Pencil Test)≥4H or above5HACC
S/M Thickness≥10 µm20.11µmACC
LocationBoth SidesBoth SidesACC
4. Component MarkMaterial TypeTAIYO/ IJR-4000 MW300IJR-4000 MW300ACC
ColorWhiteWhiteACC
LocationC/SC/SACC
5. Peelable Solder MaskMaterial Type   
Thickness   
Location   
6. IdentificationUL MarkYESYESACC
Date CodeWWYY2121ACC
Mark LocationSolder SideSolder SideACC
7. Surface FinishMethodImmersion GoldImmersion GoldACC
Tin Thickness   
Nickel Thickness3-6µm4.06µmACC
Gold Thickness0.05µm0.056µmACC
8. NormativenessRoHSDirective 2015/863/EUOKACC
REACHDirective 1907 /2006OKACC
9.Annular RingMin. Line Width (mil)5mil4.8milACC
Min. Spacing (mil)5mil5.2milACC
10.V-grooveAngle30º30ºACC
Residual thickness0.4±0.1mm0.43mmACC
11. BevelingAngle   
Height   
12. FunctionElectrical Test100% PASS100% PASSACC
13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Visual InspectionIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Warp and Twist≦0.7%0.21%ACC
14. Reliability TestTape TestNo PeelingOKACC
Solvent TestNo PeelingOKACC
Solderability Test265 ±5℃OKACC
Thermal Stress Test288 ±5℃OKACC
Ionic Contamination Test≦ 1.56 µg/c㎡0.56µg/c㎡ACC


Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole CodePTHRequiredActual valueResult
1Y0.4000.4000.4250.4250.400ACC
2Y0.4500.4500.5000.4750.450ACC
3Y0.6000.6000.6500.6250.600ACC
4Y0.7250.7500.7750.7750.750ACC
5Y0.8500.8500.8250.8500.825ACC

 

 

 

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