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High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

Shenzhen Bicheng Electronics Technology Co., Ltd
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Shenzhen Bicheng Electronics Technology Co., Ltd

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

Country/Region china
City & Province shenzhen guangdong
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Product Details

High Tg Printed Circuit Board (PCB) Made on S1000-2M With Immersion Gold and 90 Ohm Impedance Control

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of high Tg PCB with differential impedance on layer 3 at 6mil/7mil, 6mil/10mil; and layer 4 at 7mil/7mil and 6mil/7mil track/gap. It is made on high performance and low CTE FR-4 S1000-2M. It’s 6-layer board with 1 oz copper each layer, coating with hot air soldering level (HASL) and green solder mask. It’s supplied by individual board with V-cut. 25 boards are packed for shipment.

 

Applications

Computers

Communications

Automotive electronics etc.

 

 

PCB Parameters

ItemDescriptionRequirementActualResult
1. LaminateMaterial TypeFR-4 S1000-2MFR-4 S1000-2MACC
Tg170170ACC
SupplierSHENGYISHENGYIACC
Thickness1.6±10% mm1.63-1.68mmACC
2.Plating thicknessHole Wall25µm30.17µmACC
Outer copper35µm41.09µmACC
Inner Copper30µm33.69µmACC
3.Solder maskMaterial TypeTAIYO/ PSR-2000GT600DTAIYO/ PSR-2000GT600DACC
ColorGreenGreenACC
Rigidity (Pencil Test)4H or above5HACC
S/M Thickness10 µm20.11µmACC
LocationBoth SidesBoth SidesACC
4. Component MarkMaterial TypeTAIYO/ IJR-4000 MW300IJR-4000 MW300ACC
ColorWhiteWhiteACC
LocationC/SC/SACC
5. Peelable Solder MaskMaterial Type   
Thickness   
Location   
6. IdentificationUL MarkYESYESACC
Date CodeWWYY0421ACC
Mark LocationSolder SideSolder SideACC
7. Surface FinishMethodHASL Lead FreeHASL Lead FreeACC
Tin Thickness3-6µm4.06µmACC
Nickel Thickness   
Gold Thickness   
8. NormativenessRoHSDirective 2015/863/EUOKACC
REACHDirective 1907 /2006OKACC
9.Annular RingMin. Line Width (mil)6mil5.8milACC
Min. Spacing (mil)5mil5.2milACC
10.V-grooveAngle   
Residual thickness   
11. BevelingAngle   
Height   
12. FunctionElectrical Test100% PASS100% PASSACC
13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Visual InspectionIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Warp and Twist≦0.7%0.21%ACC
14. Reliability TestTape TestNo PeelingOKACC
Solvent TestNo PeelingOKACC
Solderability Test265 ±5OKACC
Thermal Stress Test288 ±5OKACC
Ionic Contamination Test 1.56 µg/c0.56µg/cACC


Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole CodePTHRequiredActual valueResult
1Y0.3750.3750.4000.4000.375ACC
2Y0.5000.5000.5500.5250.525ACC
3Y0.7*2.40.7*2.40.7*2.410.69*2.40.7*2.4ACC
4Y0.6250.6250.6000.6250.600ACC
5Y0.7250.7250.7250.7500.725ACC
6Y0.9000.9250.9000.9000.900ACC
7Y1.0001.0000.9500.9751.000ACC
8N1.0501.0501.0501.0751.050ACC
9Y1.3001.3001.3001.3251.325ACC
10Y1.3501.3501.3251.3501.325ACC
11Y1.5751.5751.6001.6001.575ACC
12Y1.6501.6501.7001.6751.675ACC
13Y1.7001.7001.7501.7251.725ACC
14Y3.2503.2503.2503.2753.250ACC
15Y3.4503.4503.4003.4253.450ACC
16Y0.7*2.60.7*2590.7*2.610.69*2.60.7*2.59ACC

 


 

Impedance Test Report

Sample NO.LayerLine Width(mil)±10%Line Space (mil)±10%Impedance TypeRequired Value (ohm)ToleranceActual ValueResult
Single EndDifferential
1L36.0007.000 V90.00±10%93.59ACC
L36.00010.000 V100.00±10%102.33ACC
L47.0007.000 V90.00±10%88.99ACC
L46.0007.000 V90.00±10%90.76ACC
         
 

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