Active Member
|
[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
|
|
| Property | RO4533 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.3 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.002 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0025 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.2 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 13 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 11 | Y | ||||
| 37 | Z | ||||
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.02 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 6.9 (1.2) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | NON FR | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |
RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
RO4533 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.
It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.
Features and Benefits
1. Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability: Greater yield on larger panels sizes
4. Uniform mechanical properties: Maintains mechanical form during handling
5. High thermal conductivity: Improved power handling
Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks
Our PCB Capability (RO4533)
| PCB Capability (RO4533) | |
| PCB Material: | Ceramic-filled, Glass-reinforced Hydrocarbon |
| Designation: | RO4533 |
| Dielectric constant: | 3.3 |
| Dissipation Factor | 0.0025 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
RO4533 Typical Values
| Property | RO4533 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.3 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.002 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0025 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.2 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 13 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 11 | Y | ||||
| 37 | Z | ||||
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.02 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 6.9 (1.2) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | NON FR | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |
