Raise the Bar with Our New High-Power RF PCB
Engineers searching for the ultimate PCB foundation for microwave
and RF designs, look no further! We're thrilled to announce the
launch of our new high-performance rigid board that takes RF
circuit design to the next level.
Built on Rogers' acclaimed RT/duroid 6035HTC material, this board
boasts best-in-class thermal management and electrical performance.
The ceramic-filled PTFE composite substrate has excellent
dielectric properties, with a low and stable loss tangent for
minimal signal loss up to 10GHz. And the high thermal conductivity
rapidly dissipates heat from high power components.
Stackup & Materials
- Substrate: Rogers RT/duroid 6035HTC, 0.762mm (30 mil) thickness.
Dielectric constant of 3.5 at 10 GHz. Extremely low loss (Df of
0.0013 at 10 GHz) and thermal coefficient of Dk of -66 ppm/°C.
Operational range of -40°C to +85°C.
- Copper Foil: Electrodeposited rolled annealed copper, 35 μm
thickness on both layers, with thermally stable reverse treat for
optimal high frequency signal integrity.
- Layer 1: Signal layer
- Layer 2: Ground/power plane layer
- Plating: 20 μm copper in holes/vias
- Final Finished Board Thickness: 0.9mm
- Final Copper Weight: 1 oz (1.4 mil) each outer layer
Layout Capabilities
- Board Dimensions: 76.05mm x 53.2mm
- Minimum Trace/Space: 6/8 mil
- Minimum Hole Size: 0.45mm
- All vias are thru-hole interconnects, no blind/buried vias
- 105 vias with 20μm copper plating for robust interconnects
- 87 components, 101 pads, supporting top and bottom SMT parts
With its reverse-treated copper layers and robust 105 vias, the PCB
enables routing intricate microwave circuits with ease. The finely
spaced traces and abundance of vias provide ample connectivity for
complex designs. And it withstands extreme thermal cycles thanks to
a thermally stable construction.
Surface Finishes
- Immersion silver surface finish on pads and traces enables
excellent solderability and thermal/electrical performance
- No solder mask for maximum heat dissipation
- No silkscreen for simplicity
Advantages:
- Excellent high frequency performance - The Rogers RT/duroid 6035HTC
dielectric material has a low loss tangent, stable dielectric
constant, and low thermal coefficient of Dk for reliable
performance up to 10GHz.
- High thermal conductivity - The ceramic-filled PTFE composite
material dissipates heat efficiently, enabling operation at higher
power levels.
- Thermally stable construction - The reverse treat copper foil
minimizes thermal expansion issues over wide temperature swings.
- High density routing capabilities - With 6/8 mil trace/space, dense
RF layouts can be achieved.
- Abundant vias - 105 vias with 20μm copper plating provide robust
interconnects between layers.
- Lead-free immersion silver finish - Provides excellent
solderability and thermal/electrical conduction from pads.
- No solder mask - Allows for maximum heat dissipation across board
surface.
- 100% electrical testing - Ensures quality and reliability.
We designed this board to be the ultimate microwave PCB platform.
Ideal for high frequency analog and digital, microwave, and mm-Wave
applications. Integrate it into your designs to reach new levels of
performance.
Of course, these advanced capabilities come at a cost. The
specialized materials and fabrication result in a higher price tag
compared to standard PCBs. And the 2-layer stackup limits routing
flexibility versus a 4+ layer board. But for RF/microwave products
where electrical performance and thermal management are vital, the
benefits outweigh the costs.
Disadvantages:
- Higher cost - The advanced dielectric material and fabrication is
more expensive than standard FR-4 PCBs.
- Limited layer count - The 2-layer construction reduces routing
flexibility compared to a 4+ layer board.
- No solder mask - Lack of solder mask may require extra handling and
cleaning precautions.
- Limited board sizes - Currently only available in one fixed
dimension of 76.05mm x 53.2mm.
- No blind/buried vias - Thru-hole vias take up more routing space
versus blind/buried vias.
- Lead time - Advanced PCBs typically have longer fabrication lead
times.
Should you have any technical inquiries or require further
assistance, please do not hesitate to contact Sally Mao at
sales30@bichengpcb.com. Our dedicated team stands ready to address
any questions or concerns you may encounter. We can't wait to see
the leading-edge innovations you create with this new RF board!