Active Member
|
[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
|
|
Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask
(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)
1.1 General description
This is a type of double sided circuit board built on FR-4 substrate with Tg 170°C for the application of keypad. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and hard gold on pads. The base material is from Shengyi supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
1.2 Features and benefits
1. Industrial standard material with high Tg (170℃ by DSC) and excellent thermal reliability;
2. Lead free assemblies with a maximum reflow temperature of 260℃;
3. SMT process is resistant to reflow soldering, resistant to rework;
4. Quick and on-time delivery;
5. ISO9001, ISO14001, UL certified manufacturing factory;
6. Competitive price;
7. No quality complaint is meant to save money;
8. Quick CADCAM checking and free PCB quotation.
1.3 PCB Specifications
| Item | Description | Requirement | Actual |
| Basic information | Board type | Double sided PCB | Double sided PCB |
| Layer count | 2 layers | 2 layers | |
| Board size | 65 x 71mm=1UP | 65 x 71mm=1UP | |
| Laminate | Laminate Type | FR4 TG≧170: CTI:175V-249V | FR4 TG≧170: CTI:175V-249V |
| Supplier | / | / | |
| Tg | TG ≧170℃ | TG ≧170℃ | |
| Finished thickness | 1.6+/-10% mm | 1.57 mm | |
| Plating Thickness | PTH Cu thickness | >20 um | 22.13um |
| Inner layer Cu Thickness | 1/1 OZ | 1/1 OZ | |
| Surface Cu thickness | 35 um | 45.1 um | |
| Solder Mask | Material type | LP-4G G-05 | LP-4G G-05 |
| Supplier | Nan Ya | Nan Ya | |
| Color | Green | Green | |
| Single / both sides | Both Sides | Both Sides | |
| S/M thickness | >=10.0 um | 26.93 um | |
| 3M tape test | NO Peel Off | no peel off | |
| Legend | Material type | S-380W | S-380w |
| Supplier | Tai yo | Tai yo | |
| Color | White | White | |
| Location | Both Sides | Both Sides | |
| 3M tape test | No peel off | no peel off | |
| Circuit | Trace Width (mm) | 0.203+/-20%mm | 0.195mm |
| Spacing (mm) | 0.203+/- 20%mm | 0.199 mm | |
| Electroplated Gold | Nickel | 100u" | 112u" |
| Gold | 10u" | 11.11u" | |
| Reliabilty Tests | Thermal shock test | 288±5℃, 10sec ,3 cycles | NO Discolor , NO Delamination |
| solder abllity test | 245±5℃ | 100% wetting | |
| Function | Electrioal Test | 100% | pass |
| Standard | IPC-A 600H class 2, IPC_6012C CLASS 2 | 100% | Pass |
| Appearance | Visual inspection | 100% | Pass |
| warp and twist | <= 0.75% | 0.26% | |
| V-Groove | V-Cut thickness | 0.4±0.1 mm | 0.41mm |
| Angle | 30+/- 5 | 30º | |
| Drill table (mm) | T1 | PTH | 0.508+/-0.075mm |
| T2 | PTH | 0.710+/-0.075mm | |
| T3 | NPTH | 5.000+/-0.05mm |
1.4 Applications
Electric Motor
Bluetooth PC
DC To DC Converter
GPS Chip
USB Wlan Adapter
Rf Transceiver
AC To DC Inverter
Controlled Access
Multicoupler Combiner
Fiber optic receptors
1.5 Our PCB Capability (2022)
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
