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20mil 2-layer rigid RO4360G2 PCB 35um copper thickness 0.6mm Immersion Silver for automotive, aerospace

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

20mil 2-layer rigid RO4360G2 PCB 35um copper thickness 0.6mm Immersion Silver for automotive, aerospace

Country/Region china
City & Province shenzhen guangdong
Categories Electrical Wires
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Product Details

A new two-layer rigid printed circuit board (PCB) designed for operation in demanding temperature environments has recently been shipped by Bicheng Electronics. The 43mm x 86mm board was constructed using hydrocarbon ceramic woven glass laminate material RO4360G2, which allows operation from -40°C to +85°C, making it suitable for automotive, aerospace, and industrial applications.

 

 

The PCB stackup consists of two 1oz copper layers, between which 20 mil of RO4360G2 dielectric material was used, resulting in a finished board thickness of 0.6mm. The lead-free fabrication process was executed to meet IPC Class 2 requirements with minimum 7/9 mil trace/space, 0.3mm minimum hole size, and 1 mil via plating.

 

There are a total of 35 components on the PCB, with 90 pads, including 26 thru-hole and 64 surface mount pads on the top layer. No components were placed on the bottom layer. The board routing contains 12 nets connecting the 46 vias between layers. Electrical testing was done to ensure 100% properly functioning boards prior to shipping.

 

SpecificationValue
Board Dimensions43mm x 86 mm +/- 0.15mm
Minimum Trace/Space7/9 mils
Minimum Hole Size0.3mm
Blind/Buried ViasNone
Finished Board Thickness0.6mm
Finished Cu Weight1 oz (1.4 mils) all layers
Via Plating Thickness1 mil
Surface FinishImmersion Silver
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo

 

The PCB layers were laid out using Gerber RS-274X format artwork for precise reproduction during fabrication. Reflow soldering will allow efficient component attachment. Selective gold plating may be applied to contact fingers or areas needing solderability protection.

 

Several features make the board well-suited for rugged applications. The RO4360G2 base material provides a Tg of >280°C for resisting high temperatures. The 1oz copper provides excellent thermal performance to dissipate heat. The woven glass reinforcement increases strength and ruggedness. Immersion silver finish was used to allow extended shelf life and excellent solderability.

 

Bicheng Electronics maintains capabilities for quick-turn prototyping in addition to medium and high volume PCB production. Their comprehensive quality system and rigorous testing ensures consistent products that meet requirements. Customers receive regular communication and support throughout the fabrication process. Any technical questions should be directed to Sally Mao at sales30@bichengpcb.com.

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