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Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

Country/Region china
City & Province shenzhen guangdong
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Product Details

Hybrid RF and Microwave Circuit Boards 3 Layer Hybrid PCB Board Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

 

The hybrid PCB can be a mixture of FR-4 and high frequency material, and a mixture of high frequency material with different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.

 

Today we’ll talk about a type of mixed high frequency PCB made on 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. It’s for the application of multi-coupler antenna.

 

 

This is a 3-layer board that one layer is etched off.

 

The basic specifications are as follows:

Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)

Dielectric constant: 3.48+/-0.05

Layer count: 3 layers

Via type: Through holes, blind vias

Format: 160mm x 90mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm | Inner layer 35μm

Solder mask / Legend: Green / White

Final PCB height: 1.3 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

 

Features and benefits

1) Lowest electrical loss for reinforeced PTFE material

2) Enhanced electrical performance;

3) 16000 square meter workshop;

4) 30000 square meter month capability;

5) 8000 types of PCB's per month;

6) More than 17 years of PCB experience;

 

Applications

Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module

 

Properties of RT/duroid 5880

RT/duroid 5880 Typical Value
PropertyRT/duroid 5880DirectionUnitsConditionTest Method
Dielectric Constant,εProcess2.20
2.20±0.02 spec.
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign2.2ZN/A8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0004
0.0009
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε-125Zppm/-50to 150IPC-TM-650 2.5.5.5
Volume Resistivity2 x 107ZMohm cmC/96/35/90ASTM D 257
Surface Resistivity3 x 107ZMohmC/96/35/90ASTM D 257
Specific Heat0.96(0.23)N/Aj/g/k
(cal/g/c)
N/ACalculated
Tensile ModulusTest at 23Test at 100N/AMPa(kpsi)AASTM D 638
1070(156)450(65)X
860(125)380(55)Y
Ultimate Stress29(4.2)20(2.9)X
27(3.9)18(2.6)Y
Ultimate Strain67.2X%
4.95.8Y
Compressive Modulus710(103)500(73)XMPa(kpsi)AASTM D 695
710(103)500(73)Y
940(136)670(97)Z
Ultimate Stress27(3.9)22(3.2)X
29(5.3)21(3.1)Y
52(7.5)43(6.3)Z
Ultimate Strain8.58.4X%
7.77.8Y
12.517.6Z
Moisture Absorption0.02N/A%0.62"(1.6mm) D48/50ASTM D 570
Thermal Conductivity0.2ZW/m/k80ASTM C 518
Coefficient of Thermal Expansion31
48
237
X
Y
Z
ppm/0-100IPC-TM-650 2.4.41
Td500N/A TGAN/AASTM D 3850
Density2.2N/Agm/cm3N/AASTM D 792
Copper Peel31.2(5.5)N/APli(N/mm)1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
FlammabilityV-0N/AN/AN/AUL 94
Lead-free Process CompatibleYesN/AN/AN/AN/A

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