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Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP for Directional Couplers

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Shenzhen Bicheng Electronics Technology Co., Ltd

Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP for Directional Couplers

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Product Details

Taconic High Frequency PCB Buitl on TLX-8 62mil 1.575mm with OSP for Directional Couplers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

TLX offers reliability in a wide range of RF applications. This material is versatile due to its 2.45 - 2.65 DK range and available thicknesses and copper cladding. It is suitable for low layer count microwave designs.

 

TLX is PTFE based fiberglass laminate, it is ideal for use in radar systems, mobile communications, microwave test equipment, microwave transmission devices and RF components.

 

TLX is a workhorse in the RF microwave substrate world where the fiberglass offers mechanical reinforcement wherever a substrate experiences severe environments such as: resistance to creep for PCBs bolted to a housing that encounter high levels of vibration during space launch, high temperature exposure in engine modules, radiation resistance in space, antenna for warships that undergo extreme environments at sea and a substrate for altimeters that see a wide range of temperatures during flight.

 

There're TLX-0 (dk2.45), TLX-9 (dk2.50), TLX-8 (dk2.55), TLX-7 (dk2.60) and TLX-6 (dk2.65) in the TLX family. Dielectric thickness of TLX-0 ranges from 0.127mm to 6.35mm (5mil-250mil), TLX-9 ranges from 0.05mm to 6.35mm (2mil - 250mil), TLX-8 ranges from 0.064mm to 6.35mm (2.5mil to 250mil), TLX-7 ranges from 0.089mm to 6.35mm (3.5mil - 250mil), TLX-6 ranges from 0.089mm to 6.35mm (3.5mil to 250mil).

 

 

Benefits:

Excellent mechanical & thermal properties

Low & stable DK

Dimensionally stable

Low moisture absorption

UL 94 V-O rating

Tightly controlled DK

Low DF

For low layer count microwave designs

 

Applications:

Antennas

Couplers, Splitters, Combiners,

Amplifiers, Mixers, Filters

Passive components

 

PCB Specifications

PCB SIZE99 x 88mm=1PCS
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 35um(1 oz)+plate TOP layer
TLX-8 1.575mm
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY 
Minimum Trace and Space:15 mil / 10 mil
Minimum / Maximum Holes:0.5mm/2.0mm
Number of Different Holes:N/A
Number of Drill Holes:N/A
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:TLX-8 1.575mm
Final foil external:1 oz
Final foil internal:N/A
Final height of PCB:1.6 mm ±10%
PLATING AND COATING 
Surface FinishOSP
Solder Mask Apply To:N/A
Solder Mask Color:N/A
Solder Mask Type:N/A
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendN/A
Colour of Component LegendN/A
Manufacturer Name or Logo:N/A
VIAN/A
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

 

 

Data Sheet of TLX-8

TLX-8 TYPICAL VALUES
PropertyTest MethodUnitValueUnitValue
DK @10 GHzIPC-650 2.5.5.3 2.55 2.55
Df @1.9 GHzIPC-650 2.5.5.5.1 0.0012 0.0012
Df @10 GHzIPC-650 2.5.5.5.1 0.0017 0.0017
Dielectric BreakdownIPC-650 2.5.6kV>45kV>45
Moisture AbsorptionIPC-650 2.6.2.1%0.02%0.02
Flexural Strength(MD)ASTM D 709psi28,900N/mm2 
Flexural Strength(CD)ASTM D 709psi20,600N/mm2 
Tensile Strength(MD)ASTM D 902psi35,600N/mm2 
Tensile Strength(CD)ASTM D 902psi27,500N/mm2 
Elongation at Break(MD)ASTM D 902%3.94%3.94
Elongation at Break(CD)ASTM D 902%3.92%3.92
Young's Modulus(MD)ASTM D 902kpsi980N/mm2 
Young's Modulus(CD)ASTM D 902kpsi1,200N/mm2 
Young's Modulus(MD)ASTM D 3039kpsi1,630N/mm2 
Poisson's RatioASTM D 3039 0.135N/mm 
Peel Stength(1 oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch15N/mm 
Peel Stength(1 oz.RTF)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch17N/mm 
Peel Stength(½ oz.ed)IPC-650 2.4.8.3(Elevated Temp.)Ibs./linear inch14N/mm 
Peel Stength(½ oz.ed)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch11N/mm 
Peel Stength(1 oz.rolled)IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)Ibs./linear inch13N/mm2.1
Thermal ConductivityASTM F433/ASTM 1530-06W/M*K0.19W/M*K0.19
Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(After Bake.)mils/in.0.06mm/M 
Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.4(After Bake.)mils/in.0.08mm/M 
Dimensional Stability(MD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.09mm/M 
Dimensional Stability(CD)IPC-650 2.4.39 Sec.5.5(Thermal Stress.)mils/in.0.1mm/M 
Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm6.605 x 108Mohm6.605 x 108
Surface ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm3.550 x 106Mohm3.550 x 106
Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)Mohm/cm1.110 x 1010Mohm/cm1.110 x 1010
Volume ResistivityIPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)Mohm/cm1.046 x 1010Mohm/cm1.046 x 1010
CTE(X axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/21ppm/21
CTE(Y axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/23ppm/23
CTE(Z axis)(25-260)IPC-650 2.4.41/ASTM D 3386ppm/215ppm/215
Density(Specific Gravity)ASTM D 792g/cm32.25g/cm32.25
Td(2% Weight Loss)IPC-650 2.4.24.6(TGA)535 
Td(5% Weight Loss)IPC-650 2.4.24.6(TGA)553 
Flammability RatingUL-94 V-0 V-0
 
 
 

 

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