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High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

High-Tg PCB Built on TU-768 With 1.2mm Thick Coating Immersion Gold Multilayer TU-768 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of High-Tg 4-layer PCB Built on TU-768 material. Each layer is plated with 1oz copper. Soldering pads are coated with immersion gold and non-pads are with green solder mask. The panel consists of 16 boards with a size of 320 x 280mm. The core is 0.8mm thick, finished PCB achieves 1.2mm thick.

 

Main Applications

Consumer Electronics

Server, workstation

Automotive

 

 

PCB Specifications

ItemDescriptionRequirementActualResult
1. LaminateMaterial TypeFR-4 TU-768FR-4 TU-768ACC
Tg170170ACC
SupplierTaiwan Union (TU)Taiwan Union (TU)ACC
Thickness1.2±10% mm1.18-1.21mmACC
2.Plating thicknessHole Wall25µm26.15µmACC
Outer copper35µm37.85µmACC
Inner Copper30µm31.15µmACC
3.Solder maskMaterial TypeTAIYO/ PSR-2000GT600DPSR-2000GT600DACC
ColorGreenGreenACC
Rigidity (Pencil Test)4H or above5HACC
S/M Thickness10µm19.55µmACC
LocationBoth SidesBoth SidesACC
4. Component MarkMaterial TypeTAIYO/ IJR-4000 MW300IJR-4000 MW300ACC
ColorWhiteWhiteACC
LocationC/S, S/SC/S, S/SACC
5. Peelable Solder MaskMaterial Type   
Thickness   
Location   
6. IdentificationUL MarkYESYESACC
Date CodeWWYY0421ACC
Mark LocationSolder SideSolder SideACC
7. Surface FinishMethodImmersion GoldImmersion GoldACC
Tin Thickness   
Nickel Thickness3-6µm5.27µmACC
Gold Thickness0.05µm0.065µmACC
8. NormativenessRoHSDirective 2015/863/EUOKACC
REACHDirective 1907 /2006OKACC
9.Annular RingMin. Line Width (mil)6mil5.8milACC
Min. Spacing (mil)5mil5.2milACC
10.V-grooveAngle30±5º30ºACC
Residual thickness0.4±0.1mm0.39mmACC
11. BevelingAngle   
Height   
12. FunctionElectrical Test100% PASS100% PASSACC
13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Visual InspectionIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Warp and Twist0.7%0.32%ACC
14. Reliability TestTape TestNo PeelingOKACC
Solvent TestNo PeelingOKACC
Solderability Test265 ±5OKACC
Thermal Stress Test288 ±5OKACC
Ionic Contamination Test 1.56 µg/c0.58µg/cACC

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