Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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Taconic CER-10 RF Printed Circuit Board 2-Layer CER-10 62mil 1.58mm PCB with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
CER-10 is an organic-ceramic DK-10 laminate in the ORCER family of Taconic products. It is based on a woven glass reinforcement. CER-10 exhibits exceptional interlaminar bond strength and solder resistance. Its proprietary composition results in low moisture absorption and uniform electrical properties.
Benefits:
Exceptional Interlaminar Bond
Low moisture absorption
Enhanced dimensonal stability
Low Z-Axis expansion
Stable DK over frequency
Increased flexural strength
Circuit board miniturization
Applications:
Power amplifiers
Filters and couplers
Passive components
CER-10’s woven glass reinforcement ensures excellent dimensional stability and enhances flexural strength. This DK-10 laminate exhibits low Z-axis expansion (CTE 46 ppm/°C), allowing for plated-through-hole reliability in extreme thermal environments.
CER-10 laminates exhibit flammability of V-0 and are tested in accordance with IPC-TM 650. A certificate of conformance containing lot-specific data accompanies each shipment.
Our PCB Capability (CER-10)
| PCB Material: | Organic-ceramic Laminate based on Woven Glass Reinforcement. |
| Designation: | CER-10 |
| Dielectric constant: | 10 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 25mil (0.635mm), 30mil(0.762mm), 47mil(1.194mm), 50mil (1.27mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG,Silver, Tin and OSP etc.. |
Typical Value of CER-10
| Property | Test Method | Unit | Value | Unit | Value |
| Dielectric Constant (Nominal) | IPC-TM-650 2.5.5.6 | 10 | 10 | ||
| Dissipation Factor 10 GHz | IPC-TM-650 2.5.5.5.1 | 0.0035 | 0.0035 | ||
| Moisture Absorption | IPC-TM-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | kV | 44 | kV | 44 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | Mohm/cm | 2.1 x 108 | Mohm/cm | 2.1 x 108 |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | Mohm | 1.1 x 109 | Mohm | 1.1 x 109 |
| Arc Resistance | IPC-TM-650 2.5.1 | Seconds | >180 | Seconds | >180 |
| Flexural Strength (MD) | ASTM D 790 | psi | 16500 | N/mm2 | 114 |
| Flexural Strength (CD) | ASTM D 790 | psi | 15500 | N/mm2 | 107 |
| Tensile Strength (MD) | ASTM D 638 | psi | 7700 | N/mm2 | 53 |
| Tensile Strength (CD) | ASTM D 3039 | psi | 6700 | N/mm2 | 46 |
| Peel Strength (1 oz. ED) | IPC-TM-650 2.4.8 | lbs/linear inch | 9 | N/mm | 1.61 |
| Dimensional Stability (MD) | IPC-TM-650 2.4.39 | in/in | -0.0002 | mm/mm | -0.0002 |
| Dimensional Stability (CD) | IPC-TM-650 2.4.39 | in/in | -0.0003 | mm/mm | -0.0003 |
| Density (Specific Gravity) | g/cm3 | 3.05 | g/cm3 | 3.05 | |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.63 | W/m/K | 0.63 |
| CTE (x-y) | ASTM D 3386 (TMA) | ppm/℃ | 13-15 | ppm/℃ | 13-15 |
| CTE (z) | ASTM D 3386 (TMA) | ppm/℃ | 46 | ppm/℃ | 46 |
| Outgassing (%TML) | ASTM E 595 | % | 0.02 | % | 0.02 |
| Outgassing (%CVCM) | ASTM E 595 | % | 0.01 | % | 0.01 |
| Outgassing (%WVR) | ASTM E 595 | % | 0.01 | % | 0.01 |
| Flammability Rating | UL 94 | V-0 | V-0 |
