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Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil High DK 12.85 RF PCB With Immersion Gold

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil High DK 12.85 RF PCB With Immersion Gold

Country/Region china
City & Province shenzhen guangdong
Categories Camera Lens Hoods
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Product Details

Rogers TMM13i High Frequency Printed Circuit Board 15mil 20mil 25mil 60mil High DK 12.85 RF PCB With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

Rogers' TMM13i thermoset microwave laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability stripline and microstrip applications. It has the dielectric constant of 12.85 and dissipation factor of 0.0019.

 

TMM13i has an exceptionally low thermal coefficient of dielectric constant. Its isotropic coefficients of thermal expansion is very closely matched to copper which results in production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM13i is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.

 

Since TMM13i is based on thermoset resins, and do not soften when heated. So wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.

 

Typical Applications

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems

 

 

Our PCB Capability(TMM13i)

PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:TMM13i
Dielectric constant:12.85
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersin tin, Immersion silver, Pure gold plated etc..

 

Why Choose Us?

1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

2.More than 18+ years’ high frequency PCB experience;

3.Small quantity order is available, no MOQ required;

4.We’re a Team of passion, discipline, responsibility and honesty;

5.Delivery on time: >98%, Customer complaint rate: <1%

6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;

7.Powerful PCB capabilities support your research and development, sales and marketing;

8.IPC Class 2 / IPC Class 3

 

Typical Value of TMM13i

PropertyTMM13iDirectionUnitsConditionTest Method
Dielectric Constant,εProcess12.85±0.35Z 10 GHzIPC-TM-650 2.5.5.5
Dielectric Constant,εDesign12.2--8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor (process)0.0019Z-10 GHzIPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant-70-ppm/°K-55-125IPC-TM-650 2.5.5.5
Insulation Resistance>2000-GohmC/96/60/95ASTM D257
Volume Resistivity--Mohm.cm-ASTM D257
Surface Resistivity--Mohm-ASTM D257
Electrical Strength(dielectric strength)213ZV/mil-IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)425425TGA-ASTM D3850
Coefficient of Thermal Expansion - x19Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y19Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z20Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity-ZW/m/K80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress4.0 (0.7)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)-X,YkpsiAASTM D790
Flexural Modulus (MD/CMD)-X,YMpsiAASTM D790
Physical Properties
Moisture Absorption (2X2)1.27mm (0.050")0.16-%D/24/23ASTM D570
3.18mm (0.125")0.13
Specific Gravity3--AASTM D792
Specific Heat Capacity--J/g/KACalculated
Lead-Free Process CompatibleYES----

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