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Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission

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Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg for High Speed Signal Transmission

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Product Details

Rogers RO3003 RF PCB bonding with FastRise-28 Prepreg for High Speed Signal Transmission

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

 

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

 


Data Sheet of RO3003 

RO3003 Typical Value
PropertyRO3003DirectionUnitsConditionTest Method
Dielectric Constant,εProcess3.0±0.04Z 10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign3Z 8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.001Z 10 GHz/23℃IPC-TM-650 2.5.5.5
Thermal Coefficient of ε-3Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
Dimensional Stability0.06
0.07
X
Y
mm/mCOND AIPC-TM-650 2.2.4
Volume Resistivity107 MΩ.cmCOND AIPC 2.5.17.1
Surface Resistivity107 COND AIPC 2.5.17.1
Tensile Modulus930
823
X
Y
MPa23℃ASTM D 638
Moisture Absorption0.04 %D48/50IPC-TM-650 2.6.2.1
Specific Heat0.9 j/g/k Calculated
Thermal Conductivity0.5 W/M/K50℃ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25
 
X
Y
Z
ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
Td500 ℃ TGA ASTM D 3850
Density2.1 gm/cm323℃ASTM D 792
Copper Peel Stength12.7 Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
FlammabilityV-0   UL 94
Lead-free Process CompatibleYes    


 

Taconic company's FastRise-28 semi-solidified sheet is specially designed for high-speed digital signal transmission applications and millimeter-wave RF multi-layer printed board manufacturing. It is matched with other microwave substrate materials of TACONIC company to manufacture multilayer microwave printed circuit boards.

 

FastRise-28 semi-solidified sheet can meet the design requirements of stripline structure with low dielectric loss. The thermosetting properties of the adhesive material make it meet the design requirements of multiple laminated manufacturing. In addition, a large number of ceramic powder fillers are selected in the composition of the semi-solidified sheet, which makes the dimensional stability of the corresponding products very good. Because of its high performance thermosetting resin, it shows good bonding effect on copper foil and some PTFE materials.

 

The main properties of this adhesive sheet material are shown in the table below.

 

FastRise-28 (FR-28) Typical Value
PropertyValueDirectionUnitsConditionTest Method
Dielectric Constant,ε2.78--10 GHzIPC-TM-650 2.5.5.5.1
Dissipation Factor,tanδ0.0015--10 GHzIPC-TM-650 2.5.5.5.1
Water Absorption0.08 % IPC TM-650 2.6.2.1
Dielectric breakdown voltage49 KV IPC TM-650 2.5.6
Dielectric strength1090 V/mil ASTM D 149
Volume Resistivity8.00 x 108 MΩ/cm IPC-TM-650 2.5.17.1
Surface Resistivity3.48 x 108  IPC-TM-650 2.5.17.1
Tg188  ASTM E 1640
Tensil strength1690Xpsi ASTM D 882
1480Ypsi
Tensil modulus304Xpsi ASTM D 882
295Ypsi
Density1.82 gm/cm³ ASTM D-792 Method A
Td709 °F IPC TM-650 2.4.24.6
Peel Strength7 lbs/in IPC-TM-650 2.4.8
Thermal Conductivity0.25 W/mk ASTM F433
Coefficient of Thermal Expansion59
70
72
X
Y
Z
ppm/ IPC-TM-650 2.4.41
Hardness68 Shore D ASTM D 2240

 

More FastRise Prepregs

fastRise Prepreg
        
ProductCarrier film (mil)Film Elognation (%)Pressed Thickness (mil)Pressed Thickness (mil)Pressed Thickness (mil)Nominal DK (Min. / Max.) (10 GHz)Typical Flow (%)
FR-26-0025-601200-3002.71.312.5817
FR-27-0030-252.330-603.52.1Not recommended2.74 (2.71 / 2.78)4
FR-27-0035-661200-3003.72.52.12.736
FR-27-0040-25330-604.93.7Not recommended2.744
FR-28-0040-501200-3004.93.73.52.81 (2.80 / 2.82)23
FR-27-0042-752.330-605.163.963.52.7335
FR-27-0045-35330-605.84.64.22.75 (2.73 / 2.77)13
FR-27-0050-40330-606.15.54.92.76 (2.71 / 2.80)23
        
    0.5 oz Cu. 50% removal1 oz. Cu. 50% removal  
        

 

Refrigeration

FastRise is a non-reinforced prepreg that is manufactured between release liners so that individual plies of FastRise do not stick together. The adhesive layer on the surface of the PTFE/cereamic film can be quite tacky especially for freshly manufactured material. It is recommended to refrigerate FastRise prior to lamination. Continuous refrigeration is always a good practice for storing prepregs as this will extend the shelf lile. However, because FastRise can be quite tacky, FastRise should be refrigerated as close to 4℃ as possible. FastRise will stiffen up and will separate from the release liners a lot easier.

 

Lamination

Various laminate cores are used in conjunction with FastRise prepreg to produce multilayer boards for the RF/digital/ATE multilayer markets. FastRise when used in a symmetrical board design, will result in optimum electrical and mechanical performance. Because of the thermoset properties of the bonding agent, multiple bonding cycles can be achieved without worry of delamination. In addition, the recommended press temperature of 215.5℃ is within reach of most boards houses.

 

Here’s a type of RF PCB built on Rogers RO3003 core bonding by FastRise-28. It is 6-layer stack-up with 1oz copper on each layer. Finished board will be 1.2mm thick, pads are immersion gold plated. There’s 2+N+2 steps blind via from layer 1 to layer 4. See the stack-up as follows.

 

 

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