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TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

Contact name:Sally Mao

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Shenzhen Bicheng Electronics Technology Co., Ltd

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

Country/Region china
City & Province shenzhen guangdong
Categories Mobile Phone Keypads
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Product Details

TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 

Brief Introduction

This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.

 
Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station, Office Routers
 

 
Detailed Specifications

ItemDescriptionActualResult
1. LaminateMaterial TypeTU-883ACC
Tg170ACC
SupplierTUCACC
Thickness2.8-3.1mmACC
2.Plating thicknessHole Wall26.51µmACC
Outer copper41.09µmACC
Inner Copper15µm / 31µmACC
3.Solder maskMaterial TypeTAIYO/ PSR-2000GT600DACC
ColorGreenACC
Rigidity (Pencil Test)5HACC
S/M Thickness20.11µmACC
LocationBoth SidesACC
4. Component MarkMaterial TypeIJR-4000 MW300ACC
ColorWhiteACC
LocationC/S, S/SACC
5. Peelable Solder MaskMaterial Type/ 
Thickness/ 
Location/ 
6. IdentificationUL MarkYESACC
Date Code2921ACC
Mark LocationSolder SideACC
7. Surface FinishMethodImmersion GoldACC
Nickel Thickness4.06µmACC
Gold Thickness0.056µmACC
8. NormativenessRoHSDirective 2015/863/EUACC
REACHDirective 1907 /2006ACC
9.Annular RingMin. Line Width (mil)4.8milACC
Min. Spacing (mil)5.2milACC
10.V-grooveAngle/ 
Residual thickness/ 
11. BevelingAngle/ 
Height/ 
12. FunctionElectrical Test100% PASSACC
13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2ACC
Visual InspectionIPC-A-600J &6012D Class 2ACC
Warp and Twist0.21%ACC
14. Reliability TestTape TestNo PeelingACC
Solvent TestNo PeelingACC
Solderability Test265 ±5ACC
Thermal Stress Test288 ±5ACC
Ionic Contamination Test0.56µg/cACC

 
Stackup & Impedance Controlled

HDI vias

 

 

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