Active Member
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[China]
Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact name:Sally Mao
Shenzhen Bicheng Electronics Technology Co., Ltd |
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10 Layer High Frequency PCB Built On 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello everyone,
Good day!
In the previous products, we’ve talked 4-layer RF PCB and 6-layer RF PCB. We have known that Rogers multilayer PCBs are made of every different core. So 10-layer RF PCB becomes simple now, is it right?
10-layer RF PCB is made on 5 cores of Rogers material. Since the final thickness will not be much thicker, so the thin core is usually used, such as 6.6mil RO4350B, 10mil RO4350B, 13.3mil RO4350B, 8mil RO4003C and12mil RO4003C etc.
Today this 10-layer PCB is on 5 cores of 10mil RO4350B combined by RO4450F prepreg.
It’s for the application of broadband wireless solutions. It's 2.0 mm thick, pads are immersion gold plated. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are packed for shipment.
Features and benefits
1) Excellent dimensional stability.
2) Good high temperature and low temperature resistance.(-192℃-260℃)
3) Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
4) Engineering design prevents problems from occurring in preproduction.
5) DDU Door to door shipment with competitive shipping cost,
6) No MOQ, low cost for prototypes and samples.
Applications
RF transceiver, Communications relays, Low Noise Block, Splitter module
Parameter and data sheet
| PCB SIZE | 115 x 110mm=1PCS=1design |
| BOARD TYPE | High Frequency PCB, Multilayer PCB |
| Number of Layers | 10 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | TOP Layer: signal - 1/2oz foil + 25μm Cu |
| Core RO4350B -0.254mm | |
| INT 1: mixed - 1/2oz foil | |
| Prepreg RO4450F -0.202mm (2 x 0.101) | |
| INT 2: mixed - 1/2oz foil | |
| Core RO4350B -0.254mm | |
| INT 3: mixed - 1/2oz foil | |
| Prepreg RO4450F -0.202mm (2 x 0.101) | |
| INT 4: mixed - 1/2oz foil | |
| Core RO4350B -0.254mm | |
| INT 5: mixed - 1/2oz foil | |
| Prepreg RO4450F -0.202mm (2 x 0.101) | |
| INT 6: mixed - 1/2oz foil | |
| Core RO4350B -0.254mm | |
| INT 7: mixed - 1/2oz foil | |
| Prepreg RO4450F -0.202mm (2 x 0.101) | |
| INT 8: mixed - 1/2oz foil | |
| Core RO4350B -0.254mm | |
| BOT Layer: signal - 1/2oz foil + 25μm Cu | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.5mil/5mil |
| Minimum / Maximum Holes: | 0.3/2.0mm |
| Number of Different Holes: | 9 |
| Number of Drill Holes: | 7505 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil) |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 2.0mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 0.05µm over 3µm nickel) |
| Solder Mask Apply To: | N/A |
| Solder Mask Color: | N/A |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH), via tented. BGA package |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
