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RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via

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Shenzhen Bicheng Electronics Technology Co., Ltd

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via

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Product Details

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

Today we’re talking about 6-layer hybrid PCB built on RO4350B and FR-4. Let’s see first one.

 

 

It’s for the application of radar antenna. Two cores of RO4350B on top side and bottom side, plated through holes connect each layer. Viewing from the stack-up, each dielectric material is more than 0.2mmm thick which result in whole PCB thickness to 1.9mm thick. Pads and holes are immersion gold plated. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.

 

 

Let’s see second one.

 

 

This type is more complex than the first one. The 10mil RO4350B core is the same. The main difference is that it contains 3 types blind via. The specifications are as follows:

 

Base material: RO4350B 10mil + FR4

Layer count: 6 layers

Type: Blind via L1-L2, L1-L3, L1-L4

Format: 82mm x 95mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: No

Final PCB height: 1.4 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

 

There’s a very similar products whose inner-layers are using half ounce copper. Finished PCB thickness is 1.0mm. Following is the stack-up and microsecton.

 

 

 

 

Therere many advantages of RO4350B hybrid PCBs.

1) Signal integrity performance improved over the stack-ups with all FR4 board;

2) Cost reduced over stack-ups with all low loss material;

3) Engineering design prevents problems from occurring in pre-production;

4) ISO9000, ISO14001, IATF16949, UL Certified factory

5) IPC Class 2 / IPC Class 3;

 

The applications are wide, listed below: Radar data acquisition converter, miscrostrip antenna, tower-mounted booster, modular oscilloscope, attenuator and 5G antenna etc.

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 

Appendix: PCB Data Sheet

PCB SIZE75 x 110mm=1PCS
BOARD TYPEMultilayer PCB
Number of Layers6 Layers
Surface Mount ComponentsYES
Through Hole ComponentsNo
LAYER STACKUPCopper ------- 35um(1 oz)+plate TOP layer
Dielectric RO4350B 0.254mm (10 mil)
Copper ------- 35um(1oz)
 PP+FR4+PP 0.695mm
 Copper ------ 35um (1oz)
 FR-4 0.25mm
 Copper ------ 35um (1oz)
 PP 0.21mm
 Copper ------35um (1oz)
 Dielectric RO4350B 0.254mm (10 mil)
 Copper ------- 35um(1 oz)+plate BOT layer
TECHNOLOGY 
Minimum Trace and Space:4 mil / 5 mil
Minimum / Maximum Holes:0.3 mm / 2.0 mm
Number of Different Holes:12
Number of Drill Holes:167
Number of Milled Slots:0
Number of Internal Cutouts:3
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL 
Glass Epoxy:RO4350B Tg280℃, er<3.48, Rogers Corp. FR-4 IT158
Final foil external:1.5 oz
Final foil internal:1 oz
Final height of PCB:1.8 mm ±0.18mm
PLATING AND COATING 
Surface FinishImmersion gold
Solder Mask Apply To:TOP, 12micron Minimum
Solder Mask Color:Green, PRS-2000GT600D, Taiyo Supplied.
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING 
Side of Component LegendTOP
Colour of Component LegendWhite, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAPlated through hole(PTH), minimum size 0.3mm. Blind via L1-L2, L3-L6
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.

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