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Flexible PCB Built On Polyimide Flex With Laser Cut FPC

Shenzhen Bicheng Electronics Technology Co., Ltd
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Address: 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China

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Shenzhen Bicheng Electronics Technology Co., Ltd

Flexible PCB Built On Polyimide Flex With Laser Cut FPC

Country/Region china
City & Province shenzhen guangdong
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Product Details

General Profile

 


A breakdown of a flexible circuit shows that it consists of 3 basic
elements: copper foil, dielectric material and adhesive. Most of the
manufacturing proceses, i.e. imaging transfer, plating and etching ,
are quite similar to those used when producing plated-through boards.
However, there're differences due to the thin and floppy material used
in flexible cirucits.

 

 

 

Purpose of Flexible Circuits

 


1) to provide interconnections between printed circuit boards and other
    components.
2) to serve as three-dimensional substrates for the mounting of SMT
    components, e.g., in photographic and video cameras.
3) to establish interconnections capable of withstanding dynam flexing.
4) to form part of rigid-flex circuit boards.

 

 

 

Advantages

 


1) Flexibility
2) Volume decreases
3) Weight reduces
4) Consistency of SMD mounting
5) Reliability increases
6) Controllability of electrical design of parameters
7) Tin soldered overall on the FPC end
8) Material optional( PI, PET)
9) Low cost
10) Continuity of processing

 

 

 

Applications

 


Thin-film switch, Capacitive touch screen / panel, Keypad FPC, Laser
head FPC,General purpose LED soft light strip, Mobile phone built-in
antenna FPC Touch screen,Telephone receiver / earphone FPC,
Contact belt of inkjet printer, Toy lamp strip,LCD module, Instrument
panel, Flexible flat cable, Display backlight etc.

 

 

 

Bicheng Flexible Printed Circuit Capability

No.SpecificationsCapabilities
1Board Type

Single layer, Doulbe layer,

Multilayer, Rigid-Flex

2Base MaterialPI, PET
3Copper Weight0.5oz, 1oz, 2oz
4LED Maximum Size250 x 5000mm
5General Maximum Size250 x 2000mm
6Board Thickness0.03mm-3.0mm
7Thickness Tolerance±0.03mm
8Mininum Drill Hole0.05mm
9Maximum Drill Hole6.5mm
10Tolerance of Drill Hole±0.025mm
11Thickness of Hole Wall≧ 8 um
12

Minimum Track/Gap of Single

Layer Board

0.025/0.03mm
13

Minimum Track/Gap of Double

Layer and Multilayer Board

0.03/0.040mm
14Etching Tolerance±0.02mm
15Minimum Width of Silk Legend≧ 0.125mm
16Minimum Heigh of Silk Legend≧0.75mm
17Distance from Legend to Pad≧0.15mm
18

Distance from Opening Solder

Mask of Drill Coverlay to Track

≧0.03mm
19

Distance from Opening Solder Mask

of Punching Coverlay to Track

≧0.03mm
20Thickness of Immersion Nickel100-300u"
21Thickness of Immersion Gold1-3u"
22Thicnkess of Immersion Tin150-400u"
23Minimum Electrical Testing Pad0.2mm
24

Minimum Tolerance of Outline

(Normal Steel Mould Punch)

±0.1mm
25

Minimum Tolerance of Outline

(Precision Steel Mould Punch)

±0.05mm
26

Mininum Radius of Bevel Angle

(Outline)

0.2mm
27Stiffner Material

PI, FR-4, 3M Adhesive, PET,

Steel Sheet

28RoHsYes
29Solder Mask ColourYellow, White, Black, Green

 

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