Active Member
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[China]
Address: Room 36B1-B2, Building C, Electronics Science & Technology Building Shennan Mid-Road, Shenzhen China
Contact name:Sharon Yang
Anterwell Technology Ltd. |
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Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Directivity Radiation
STOCK LIST
| BS107ARL1G | 1560 | ON | 15+ | TO-92 |
| FOD617D300 | 2200 | FSC | 14+ | DIP-4 |
| FODM3023 | 2200 | FAIRCHILD | 16+ | SOP-4 |
| 74LVC1G3157GV | 7500 | NXP | 15+ | SOT-457 |
| 74HC540D | 7500 | NXP | 15+ | SOP |
| 74LVC1G157GV | 7500 | NXP | 16+ | SOT-163 |
| HCF4069UM013TR | 3460 | ST | 16+ | SOP |
| ADS1256IDBR | 2000 | TI | 16+ | SSOP-28 |
| EL4543IUZ | 2940 | INTERSIL | 15+ | SSOP |
| EL5375IUZ | 2910 | INTERSIL | 16+ | SSOP |
| AT89C51-24PI | 2300 | ATMEL | 15+ | DIP |
| 2SJ327-Z-E1 | 3000 | NEC | 15+ | TO-252 |
| 2SK3271 | 3000 | FUJI | 15+ | TO-3P |
| IR2304 | 1500 | IR | 16+ | DIP-8 |
| ADM5120PX-AB-T-2 | 2000 | 15+ | QFP | |
| GBU608 | 3460 | SEP | 15+ | DIP |
