Digital Integrated Circuit Chip M48T08-70PC1 CMOS 8K X 8 TIMEKEEPER SRAM

M48T08-70PC1
CMOS 8K x 8 TIMEKEEPER SRAM
■ INTEGRATED ULTRA LOW POWER SRAM, REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT, AND BATTERY
■ BYTEWIDE™ RAM-LIKE CLOCK ACCESS
■ BCD CODED YEAR, MONTH, DAY, DATE, HOURS, MINUTES, and SECONDS

■ TYPICAL CLOCK ACCURACY OF ±1 MINUTE A MONTH, AT 25°C

■ AUTOMATIC POWER-FAIL CHIP DESELECT AND WRITE PROTECTION

■ WRITE PROTECT VOLTAGES(VPFD = Power-fail Deselect Voltage):
   – M48T08: VCC = 4.75 to 5.5V 4.5V ≤ VPFD ≤ 4.75V

   – M48T18/T08Y: VCC = 4.5 to 5.5V 4.2V ≤ VPFD ≤ 4.5V

■ SOFTWARE CONTROLLED CLOCK CALIBRATION FOR HIGH ACCURACY APPLICATIONS

■ SELF-CONTAINED BATTERY AND CRYSTAL IN THE CAPHAT™ DIP PACKAGE

■ PACKAGING INCLUDES A 28-LEAD SOIC AND SNAPHAT® TOP (to be ordered separately)

■ SOIC PACKAGE PROVIDES DIRECT CONNECTION FOR A SNAPHAT TOP WHICH CONTAINS THE BATTERY AND         CRYSTAL

■ PIN AND FUNCTION COMPATIBLE WITH DS1643 and JEDEC STANDARD 8K x8 SRAMs

■ RoHS COMPLIANCE Lead-free components are compliant with the RoHS Directive.

Absolute Maximum Ratings

Note: 1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to |
              exceed 150°C for longer than 30 seconds).

          2. For SO package, standard (SnPb) lead finish: Reflow at peak temperature of 225°C (total thermal budget
              not to exceed 180°C for between 90 to 150 seconds).

          3. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget
              not to exceed 245°C for greater than 30 seconds).

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