THGAMVG7T13BAIL Integrated Circuit IC Flash Memory IC 128GBIT EMMC 153FBGA

• 16GB to 128GB memory

• BiCS 3D NAND technology

• Multi-Level Cell (MLC) technology

• Conforms to the latest JEDEC version 5.1

• Integrated memory management:

  • Error correction code

  • Bad block management

  • Wear-levelling

  • Garbage collection

• Higher interface speed HS400 in accordance with JEDEC 5.1

• Managed memory

• Utilizes high-quality Toshiba MLC NAND flash memory in combination with a Toshiba origin developed controller

• Operating temperature ranges:

  • -25°C to +85°C (standard)

• FBGA package

• Industrial

• Consumer electronics

• Multimedia

• Smart metering

• Intelligent lighting

• Smart applications

ORIGINAL

Our company ensures that each batch of products comes from the original factory, and can provide original labels and professional testing agency reports.

PRICE

We provide a variety of quotation channels, and sign the order contract after negotiation.

TRANSACTION

After communication and agreement, we will guide you to arrange payment.

DELIVERY CYCLE

Delivery on the same day, generally 5-12 working days, may be slightly delayed during the epidemic, we will follow up the whole process.

TRANSPORT

We will choose the appropriate transportation mode according to your country.

PACKAGING

After communication with you, we will choose the appropriate packaging method according to the weight of the goods to ensure the safe delivery of the goods.