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1206 Thin Film Surface Mount Fast Blow Chip Fuse 12B1100B 1A 125V 3216 Metric With 50 Amp Interrupting Rating

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Aolittel Technology Co.,Ltd

1206 Thin Film Surface Mount Fast Blow Chip Fuse 12B1100B 1A 125V 3216 Metric With 50 Amp Interrupting Rating

Country/Region china
City & Province dongguan guangdong
Categories Electrical Plugs & Sockets
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Product Details

 

1206 Thin Film Surface Mount Fast Blow Chip Fuse 12B1100B 1A 125V 3216 Metric With 50 Amp Interrupting Rating

 

 

Description

 

Range of chip fuses are compact and precise circuit protection for all applications
Broad range of surface mount chip fuses to provide optimal overcurrent protection in dense secondary circuits. These circuits are found in consumer electronics, such as battery operated, handheld, and portable electronic devices including laptops, cell phones, GPS systems, PDAs and many other devices which continue to demand increasingly smaller componentsThe range of fuses is offered with quick, super-quick-acting, and time-lag characteristics. Each fuse series boasts unique performance characteristics such as low voltage drop and high breaking capacity. The current ratings range from 50 mA to 25 A. Rated voltage for these components are up to 125 VAC/VDC.
 
 

Quick Details

 

Testing Standard:UL248-1 UL248-14

Interrupting Rating:50 Amperes at 125V AC/DC

Operating Temperature:-55℃ ~+125℃

Materials:
Substrate:ceramic/glass cover
Termination:sliver over-plated with nickel and tin
Element:silver

Soldering Method:
Reflow soldering: 260℃, 10s max

Packaging:
Automaton taped 3000PCS per rell,
90000PCS per carton

 

 

 

Dimension in mm

 

 

 

Specification

 

CatalogAmpereVoltage 
Marking
Melting Integral
No.RatingRating(A2.S)
12B0250B250mA125V.250.0035
12B0375B375mA125VE0.0011
12B0500B500mA125V0.50.0020
12B0750B750mA125V.750.0053
12B1100B1A125V10.0062
12B1125B1.25A125VJ0.022
12B1150B1.5A125V1.50.028

 

 

Electrical Characteristics

 

Ampere RatingAmpere RatingOpening Time
250mA~1.5A100%4 hours Min
250mA~1.5A250%5 s Max 

 

 

Time-Current Characteristics

 

 

 

 

Applications

 

- Applications where high reliability and availability is needed

- Medical equipment

- Offshore

- Defense

 

 

Environmental data

 

Soldering Methods Reflow, Wave Soldering Profile

Solderability 245°C / 3sec acc. to IEC 60068-2-58, Test Td

Resistance to Soldering Heat 260 +0/-5°C / 30sec acc. to IPC/JEDEC J-STD-020D, Level 1

Life Test MIL-STD-202, Method 108A 1000h @ 0.60 x In @ 70°C

Load Humidity Test MIL-STD-202, Method 103B 0.1 x In @ 0.85 r.H. @ 85°C

Moisture Resistance Test MIL-STD-202, Method 106E (50 cycles in a temp./mister chamber)

Terminal Strength MIL-STD-202, Method 211A (Deflection of board 1 mm for 1 minute)

Thermal Shock MIL-STD-202, Method 107D (200 air-to-air cycles from -55 to +125°C)

Resistance to Solvents MIL-STD-202, Method 215A

Flammability min. UL 94V-1 (acc. to EIA/IS-722, Test 4.12)

 

 

Derating Curves

 

 

 

Features

 

Current ratings from 50 mA to 25 A
Rated voltages up to 125 VAC/VDC
High breaking capacity up to 600 A (internal tests)
Super-quick-acting (FF), quick-acting (F), and time-lag (T)
Precise, low loss, resistant to vibrations and pulses

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