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Bourns SinglFuse SF-2410FP100W-2 Cross UL 248-14 Precision Wire Core Surface Mount Fuses SEF 1.0A Fast Acting 2410

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Aolittel Technology Co.,Ltd

Bourns SinglFuse SF-2410FP100W-2 Cross UL 248-14 Precision Wire Core Surface Mount Fuses SEF 1.0A Fast Acting 2410

Country/Region china
City & Province dongguan guangdong
Categories Electronic & Instrument Enclosures
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Product Details

 

Bourns SinglFuse SF-2410FP100W-2 Cross UL 248-14 Precision Wire Core Surface Mount Fuses SEF 1.0A Fast Acting 2410

 

 

Application

 

LCD / LED TVs
White goods
PC servers

LCD monitors
DC/DC converters
DC/AC inverters
Notebooks / ultrabooks
Telecom systems
Chargers

 

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Features

 

Single blow fuse for overcurrent protection
6125 (EIA 2410) footprint
Fast acting precision
UL 248-14 listed
RoHS compliant* and halogen free
Wire core SMD design
Surface mount packaging for automated assembly

 

 

Dimension

 

 

 

Part Numbering

 

Catalog

No.

Ampere

Rating

Voltage

Rating

Breaking

Capacity

Nominal Cold

Resistance

(Ohms)

I2TMelting

Integral(A2.S)

Agency Approvals
ULCUL
SEF0200200mA250VAC

50A@300VAC

50A@250VAC

200A@125VAC

0.9600.148
SEF0250250mA0.8600.145
SEF0300300mA0.6200.162
SEF0315315mA0.5500.189
SEF0375375mA0.4700.200
SEF0400400mA0.3800.238
SEF0500500mA0.3200.275
SEF0600600mA0.2850.470
SEF0630630mA0.2560.566
SEF0700700mA0.2080.805
SEF0750750mA0.1751.240
SEF0800800mA0.1551.880
SEF11001A0.1483.500
SEF11251.25A0.1024.760
SEF11501.5A0.0856.305
SEF12002A0.0448.950
SEF12502.5A0.04316.025
SEF13003A0.03321.560
SEF13153.15A0.02922.750
SEF13503.5A0.02727.050
SEF14004A0.02531.808
SEF15005A0.01940.250
SEF16006A0.01867.245
SEF16306.3A0.01773.550
SEF17007A0.01576.280

 

 

Environmental Characteristics

 

Operating Temperature-55 °C to +125 °C
Storage Conditions Temperature+5 °C to +35 °C
Humidity40 % to 75 %
Shelf Life2 years from manufacturing date
Moisture Sensitivity Level1
ESD Classification (HBM)Class 6

 

 

Times Performances

 

% of Ampere Rating(In)

Blowing Time

100% * In4 hours Min
200% * In120 sec Max
1000% * In10ms Min

 

 

Average Time Current Curves

 

 

 

Reliability Testing

 

No.TestRequirementTest ConditionTest Reference
1Reflow and bend

DCR change ≤ 20 % (≤ 10 % for ≤1 A)

No mechanical damage

3 reflows at 245 °C followed by a
2 mm bend
Refer to STP
document
2SolderabilityMinimum 90 % coverageOne dip at 245 °C for 5 secondsMIL-STD-202
Method 208
3Soldering heat
resistance
DCR change ≤ 20 % (≤ 10 % for ≤1 A)
New solder coverage ≤ 75 % 
One dip at 260 °C for 10 secondsMIL-STD-202
Method 210
4Moisture resistanceDCR change ≤ ±15 % No excessive corrosion 10 cyclesMIL-STD-202
Method 106
5Salt sprayDCR change ≤ ±10 %
No excessive corrosion
48 hour exposure, 5 % salt solutionMIL-STD-202
Method 101
6Mechanical vibrationDCR change ≤ ±10 %
No mechanical damage
0.4 inch D.A. or 30 G between
5-3000 Hz
MIL-STD-202
Method 204
7Mechanical shockDCR change ≤ ±10 %
No mechanical damage
1500 G, 0.5 ms, half-sine shocksMIL-STD-202
Method 213
8Thermal ShockDCR change ≤ ±10 %
No mechanical damage
100 cycles between -65 °C and +125 °CMIL-STD-202
Method 107
9LifeNo electrical “opens” during testing
Voltage drop change shall be less
than ±20 % of initial value
80 % rated current (75 % for < 1 A fuses)
for 2000 hours at ambient temperature
+25 °C
Refer to STP
document


* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

 

 

Current Rating Thermal Derating Curve

 

 

 

Solder Reflow Recommendations

 

Reflow ConditionPb-Free assembly
Average ramp-up rate (Ts(max)to Tp)5°C /second max.
PreheatTemperature Min (Ts(min))150°C
Temperature Max (Ts(max))200°C
Time (Min to Max) (ts)60-120 seconds
ReflowTemperature (TL)220°C
Time Max (tL)60 seconds
Peak Temperature(Tp)260°C max
Ramp-down Rate5°C/second max
Time 25°C to peak Temperature (Tp)8 minutes max

 

 

Recommended Temperature Profile for Wave Soldering

 

 

Wave soldering is suitable for 2410 size models. 

 

 

Packaging

 

1,000 pcs in 7 inches dia. reel, 12mm wide tape, EIA Standard 481

 

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