Active Member
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[China]
Address: NO.27,Jinlanling Street,Taigongling Village Dongguan 523829,Guangdong,China
Contact name:Eric
Aolittel Technology Co.,Ltd |
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3216FF1.5-R 1206 Fast Blow SMD Chip Encapsulation Surface Mount
Fuses 32VAC DC 1.5A With UL CSA RoHS Reach Approved
Benefit
Small size with high current ratings
Excellent temperature stability
High reliability and resilience
Strong arc suppression characteristics
Environmental data
• Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 °C
to +125 °C)
• Vibration: MIL-STD-202, Method 204, Test Condition C (55 Hz - 2
kHz, 10 G)
• Moisture Resistance: MIL-STD-202, Method 106,10 day cycle
• Solderability: ANSI/J-STD-002, Test B
• Additional resistance to solder heat test: MILSTD-202G Method
210F Condition A
• Operating Temperature: -55 ºC to +125 ºC
• AEC-Q200 qualified (250 mA to 7 A)
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General
Fast-acting fuses help provide overcurrent protection on
systems using DC power sources up to 63VDC. The fuse's
monolithic,multilayer design provides the highest hold current in
the smallest footprint, reduces diffusion-related aging,
improves product reliability and resilience, and enhances high
temperature
performance. This helps facilitate the development of
more reliable, high-performance consumer electronics such as
laptops, multimedia devices, cell phones, and other portable
electronics.
Features
Multilayer monolithic structure with glass ceramic body and silver
fusing element
Silver termination with nickel and pure-tin solder plating,
providing excellent solderability
AEC-Q200 qualified (250 mA to 7 A)
Fast-acting surface mount fuse
Ratings up to 30 amps
Excellent temperature and cycling characteristics
Compatible with reflow and wave solder
RoHS compliant
High temperature performance
-55°C to +125°C operating range
Soldering method
• Wave Immersion: 260 °C, 10 sec max.
• Infrared Reflow: 260 °C, 30 sec max.
Packaging
| Package data | |
| Part Number | Description |
| 12 100 X | 3000 fuses on 8mm tape-and-reel on a 7 inch (178mm) reel per EIA Standard RS481 |
Application
Circuit Protecting in LCD monitors, PC cards, disk drives, portable
communication products, PDAs, digital cameras, DVDs, TVs, cell
phones, rechargeable battery packs, battery chargers, etc.
Material Specifications
| Construction Body Material | Ceramic |
| Termination Material | Silver, Nickel, Tin |
| Fuse Element | Sliver |
| Terminal Strength | Hanging test: |
Reliability Tests
| No. | Test | Requirement | Test Condition | Test reference |
| 1 | Soldering heat resistance | DCR change ≤±10% | One dip at (260±5)℃ for (5±1) sec | MIL-STD-202 |
| 2 | Solderability | Minimum 95% coverage | One dip at (235±5)℃ for (5±1) sec | MIL-STD-202 |
| 3 | Thermal shock | DCR change ≤±10% | 1000 cycles between -45 ℃ and +125℃ | Refer to Ao littel Standard |
| 4 | Moisture resistance | DCR change ≤±15% | 10 cycles | MIL-STD-202 |
| 5 | Mechanical vibration | DCR change ≤±10% | 0.4" D.A. or 30 G between 5- 3000 Hz | MIL-STD-202 |
| 6 | Mechanical shock | DCR change ≤±10% | Fall from 1 m height of the floor 10 times | MIL-STD-202 Method 213 |
| 7 | Terminal strength | DCR change ≤±10% | 30 sec. hanging for 1206 (1.0kg) and 0603 (0.5KG) | Refer to Ao littel Standard |
| 8 | Life | No electrical "opens" during testing voltage drop change shall be less than±20% of initial value | 80% Rated current ambient temperature +25℃ to +28 ℃,2000 hours | Refer to Aolittel Standard |
| 9 | Bending | No electrical "opens" during testing | 2 mm bending ,more than 5 seconds | Refer to Ao littel Standard |
Cautions and warnings:
1,Handling CHIP FUSE must not be dropped. Chip-offs must not be
caused during handling of FUSEs. Components must not be
touched with bare hands. Gloves are recommended. Avoid
contamination of fuse surface during handling.
2,Soldering Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks. Rapid cooling by
dipping in solvent is not recommended. Complete removal of flux is
recommended.
3,Mounting Electrode must not be scratched
before/during/after the mounting process. Contacts and
housings used for assembly with fuses have to be clean before
mounting. During operation, the fuse’s surface temperature
can be very high (ICL). Ensure that adjacent components are placed
at a sufficient distance from the fuse to allow for proper cooling
of the fuses. Ensure that adjacent materials are designed for
operation at temperatures comparable to the surface temperature of
the fuse. Be sure that surrounding parts and materials can
withstand this temperature. Avoid contamination of fuse
surface during processing.
4,Operation Use fuses only within the specified operating
temperature range. Environmental conditions must not
harm the fuses. Use fuses only in normal atmospheric conditions.
Contact of chip fuses with any liquids and solvents should be
prevented. It must be ensured that no water enters the chip fuse
(e.g. through plug terminals). For measurement purposes (checking
the specified resistance vs. temperature), the component must not
be immersed in water but in suitable liquids (e.g. Galden).
Avoid dewing and condensation.
Notice: Specifications of the products displayed herein are subject to
change without notice. We assume no responsibility or liability for
any errors or inaccuracies. Information contained herein is
intended to provide a product description only. No license, express
or implied, by estoppel or otherwise, to any intellectual property
rights is granted by this document. Except as provided in
Aolittel's terms and conditions of sale for such products,
Aolittel assumes no liability whatsoever, and disclaims any
express or implied warranty, relating to sale and/or use of Wayon
products including liability or warranties relating to fitness for
a particular purpose, merchantability, or infringement of any
patent, copyright, or other intellectual property right.
Specifications are subject to change without notice.
