Shanghai Tankii Alloy Material Co.,Ltd |
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CuNi23 (alloy 180) Copper Nickel Alloy Wire/Flat Wire/Strip/foil
Midohm
Product Description
CuNi23Mn low resistance heating alloy is widely used in low-voltage
circuit breaker, thermal overload relay, and other low-voltage
electrical product. It is one of the key materials of the
low-voltage electrical products. The materials produced by our
company have the characteristics of good resistance consistency and
superior stability. We can supply all kinds of round wire, flat and
sheet materials.
Chemical Content, %
Ni | Mn | Fe | Si | Cu | Other | ROHS Directive | |||
Cd | Pb | Hg | Cr | ||||||
23 | 0.5 | - | - | Bal | - | ND | ND | ND | ND |
Mechanical Properties
Max Continuous Service Temp | 250ºC |
Resisivity at 20ºC | 0.35%ohm mm2/m |
Density | 8.9 g/cm3 |
Thermal Conductivity | 16(Max) |
Melting Point | 115ºC |
Tensile Strength,N/mm2 Annealed,Soft | 270~420 Mpa |
Tensile Strength,N/mm2 Cold Rolled | 350~840 Mpa |
Elongation(anneal) | 25% (Max) |
Elongation(cold rolled) | 2% (Max) |
EMF vs Cu, μV/ºC (0~100ºC) | -25 |
Micrographic Structure | austenite |
Magnetic Property | Non |
CuNi23Mn Tradenames:
Alloy 180, CuNi 180, 180 Alloy, MWS-180, Cuprothal 180, Midohm,
HAI-180, Cu-Ni 23, Alloy 380, Nickel alloy 180
Resistance Alloy 180 - CuNi23Mn Sizes / Temper Capabilities
Condition: Bright, Annealed, Soft
Wire diameter 0.02mm-1.0mm packing in spool, big than 1.0mm packing
in coil
Rod, Bar diameter 1mm-30mm
Strip: Thickness 0.01mm-7mm, Width 1mm-280mm
Enameled condition is available
PropertiesGrade | CuNi1 | CuNi2 | CuNi6 | CuNi8 | CuMn3 | CuNi10 | |
Main Chemical Composition | Ni | 1 | 2 | 6 | 8 | _ | 10 |
Mn | _ | _ | _ | _ | 3 | _ | |
Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
Max Continuous Service Temperature(oC) | 200 | 200 | 200 | 250 | 200 | 250 | |
Resisivity at 20oC (Ωmm2/m) | 0.03 | 0.05 | 0.10 | 0.12 | 0.12 | 0.15 | |
Density(g/cm3) | 8.9 | 8.9 | 8.9 | 8.9 | 8.8 | 8.9 | |
Thermal Conductivity(α×10-6/oC) | <100 | <120 | <60 | <57 | <38 | <50 | |
Tensile Strength(Mpa) | ≥210 | ≥220 | ≥250 | ≥270 | ≥290 | ≥290 | |
EMF vs Cu(μV/oC)(0~100oC) | -8 | -12 | -12 | -22 | _ | -25 | |
Approximate Melting Point( oC) | 1085 | 1090 | 1095 | 1097 | 1050 | 1100 | |
Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
Magnetic Property | non | non | non | non | non | non | |
PropertiesGrade | CuNi14 | CuNi19 | CuNi23 | CuNi30 | CuNi34 | CuNi44 | |
Main Chemical Composition | Ni | 14 | 19 | 23 | 30 | 34 | 44 |
Mn | 0.3 | 0.5 | 0.5 | 1.0 | 1.0 | 1.0 | |
Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
Max Continuous Service Temperature(oC) | 300 | 300 | 300 | 350 | 350 | 400 | |
Resisivity at 20oC (Ωmm2/m) | 0.20 | 0.25 | 0.30 | 0.35 | 0.40 | 0.49 | |
Density(g/cm3) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | |
Thermal Conductivity(α×10-6/oC) | <30 | <25 | <16 | <10 | <0 | <-6 | |
Tensile Strength(Mpa) | ≥310 | ≥340 | ≥350 | ≥400 | ≥400 | ≥420 | |
EMF vs Cu(μV/oC)(0~100oC) | -28 | -32 | -34 | -37 | -39 | -43 | |
Approximate Melting Point( oC) | 1115 | 1135 | 1150 | 1170 | 1180 | 1280 | |
Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
Magnetic Property | non | non | non | non | non | non |