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UL DLC SAA CE 460W Led High Bay Light Heat Pipe 6000K IP65 waterproof

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UL DLC SAA CE 460W Led High Bay Light Heat Pipe 6000K IP65 waterproof

Country/Region china
City & Province shenzhen guangdong
Categories Lighting Agents

Product Details

 

UL DLC SAA CE 460W Led High Bay Light Heat Pipe 6000K IP65 waterproof

 

Quick Detail:

  1. Power supply:MeanWell Driver
  2. Lamp Power (W): 460
  3. Input Voltage (V): AC100~277V 50/60Hz
  4. Place of Origin: Guangdong China
  5. Lamp: CREE XLMB
  6. Gross Weight: 15kg
  7. Package Size: 660x600x600mm

Description:

 

CREE Second Generation XMLB LED, high luminous efficiency and long life.
MEAN WELL High efficiency LED Driver, the wide range input voltage AC100-277V;
Heat pipe with fins cooling design, better cooling, light quality, LED Tj < 85℃.
Excellent lampshade design, greatly improve the light utilization and evenness.

 

Structure Features:

 

Shell materials: Heat pipe and cooling fins for 1070 aluminum alloy.

Color: Silver white (Electrolytic shading)
Net weight:15.00Kg Unit:mm

 

 

 

Specifications:

 

TypeUL-HB46W27-xxK
Power460WLighting Angle45°/80°/120°
Input VoltageAC100-277VLED Brightness Decay<5%/6000 hrs
PF>0.95Working Life>50000 hrs
Driver Efficiency>90%Working Temperature-30 - +40℃
Luminous Flux43500 LmStorage Temperature-40 -+80℃
Color Temperature3000K/4000k/5000K/6500kProtection LevelWet Location/IP65
CRIRa>75Cable3 core,18AWG(1.5m)

 

Applications:

 

UL LED High Bay Lighting series can be widely used in outdoor, indoor or outdoor lighting(Wet location), like mechanical or electronic processing workshops, storage warehouses, steel mills, gas stations, toll booth, waiting rooms, the platforms of railway station , indoor stadiums and flower cultivating tents etc.

 

 

Competitive Advantages:

 

 

1, BASED ON CREES SC3 TECHNOLOGY PLANFORM

Using XMLB LED of CREE Inc,Based on Cree’s SC3 technology platform,High efficiency and high reliability.

 

2, TESTING BY X-RAY

LED soft soldering testing by X-RAY for cold solder joint and soldering related non-conforming.

 

3,COPPER SUBSTRATE

Heat conductivity coefficient of copper substrate is 383.8W/m.K,but the traditional aluminum substrate is about 2.0-3.0W/m.K.

 

4,USING DLC TECHNOLOGY FOR MPCB

Using DLC technology for MPCB module,heat conduction rate at 200W/m.K,lower junction temperature.

 

5,USING METAL POWDER ADHESIVE

Using high conduction adhesives 30W/m.K,not the heat conductive silicone grease,it’s metal powder adhesive.

 

6,USING HEAT PIPE AND COOLING FINS FOR 1070 ALUMINUM ALLOY

Using heat pipe and cooling fins for 1070 aluminum alloy,fast conduction.

 

7,24 HOURS HIGH TEMPERATURE TESTING

High temperature testing room at 106℉,24 hours aging after aging.

30 minutes switch aging(10 seconds per cycle)

 

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