|
[China]
Trade Verify
Address: Building A, Bangkai Science & Technology Industrial Park, No. 9 Bangkai Road, Hi-Tech Industrial Park, Guangming District, Shenzhen
Contact name:James Lee
Unicomp Technology |
|
Verified Suppliers
|
|
|
● SMT, BGA, CSP, Flip Chip, LED Detection.
● Semiconductor, Packaging components, Battery Industry.
● Electronic components, Auto parts, Photovoltaic Industry.
● Aluminum Die-casting, Moulding Plastic.
● Ceramics, Other Special Industries.
Features:
● 1000X magnification, high-definition real-time image.
● 90-130KV 7μm X-Ray tube.
● High speed & Millions pixels high resolution FPD.
● One-button operation with 2.5D image display.
● Off-line programming function, navigation mode detection.
● 7 axis linkage, 70 degree tilt detection.
| Item | Definition | Specs |
| System Parameters | Size | 1350(L)x1250(W)x1700(H)mm |
| Weight | 1900kg | |
| Power | 220AC/50Hz | |
| Power Consumption | 1.6kW | |
| X-ray Tube | Type | Closed |
| Max.Voltage | 130kV | |
| Max.Power | 40W | |
| Spot Size | 7μm | |
| X-ray System | Intensifier | FPD |
| Monitor | 22 ‘’LCD | |
| System Magnification | 1600 X | |
| Detection Region | Max.Loading Size | Φ570mm |
| Max.Inspection Area | 450mm x 450mm | |
| X-ray Leakage | <1μSv/h | |
Test Images:
