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1000W Rotary Ultrasonic Assisted Machining Drilling Or Milling For Ceramic

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Hangzhou Altrasonic Technology Co., Ltd

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1000W Rotary Ultrasonic Assisted Machining Drilling Or Milling For Ceramic

Country/Region china
City & Province zhejiang
Categories Manufacturing & Processing Machinery Processing Services

Product Details

20K 1000W Rotary Ultrasonic Machining, High Quality Drilling or Milling For Ceramic

 

Description: 

 

Ultrasonic milling is a new type of ultrasonic processing technology, which USES simple shape tool, based on hierarchical in rapid prototyping manufacturing, using the method of layered removal machining hard and brittle materials, it has a simple tool making, small macro forces between tool and workpiece, tool wear can be compensated, which can realize complex three-dimensional contour machining, etc.

 

Main parts:

Power Source: As we know, this machining process requires high frequency ultrasonic wave. So a high frequency high voltage power supply require for this process. This unit converts low frequency electric voltage (60 Hz) into high frequency electric voltage (20k Hz).

Magnetostrictive transducer: Transducer is a device which converts electric single into mechanical vibration. In ultrasonic machining magnetostrictive type transducer is used to generate mechanical vibration. This transducer is made by nickel or nickel alloy.

 

Booster: The mechanical vibration generated by transducer is passes through booster which amplify it and supply to the horn.

 

Tool: The tool used in ultrasonic machining should be such that indentation by abrasive particle, does not leads to brittle fracture of it. Thus the tool is made by tough, strong and ductile materials like steel, stainless steel etc.

 

Tool holder or Horn: As the name implies this unit connects the tool to the transducer. It transfers amplified vibration from booster to the tool. It should have high endurance limit.

 

Abrasive Slurry: A water based slurry of abrasive particle used as abrasive slurry in ultrasonic machining. Silicon carbide, aluminum oxide, boron carbide are used as abrasive particle in this slurry. A slurry delivery and return mechanism is also used in USM.

 

 

Technical Parameters:

 

Frequency20Khz/40Khz
Output Power500-1000W
Voltage110- 240V
Speed3000 - 10000 r/min
Power AdjustingStep or continuous
Working Time Control24 Hours
Weight30 KG
ApplicationUltrasonic Drilling/Milling/Cutting
GeneratorDigital Generator, auto-tuning
Resonance point amplitude10um or more
Matching toolmill head Φ2-Φ13; disk cutter Φ50; dilling head Φ2-Φ6
Length of cable3M or Customized

 

 

Advantages:

 

1. It is not limited by the conductivity of materials. It is suitable for punching, cutting, grooving, nesting, engraving, etc. of various hard and brittle materials such as glass, quartz, ceramic, silicon, ferrite, gemstone and jade. Batch deburring of small parts, surface polishing of the mold and dressing of the grinding wheel.

2. The processing precision is high and the surface quality is high. The aperture diameter of ultrasonic drilling is 0.1~90mm, the processing depth can reach more than 100mm, and the precision of the hole can reach 0.02~0.05mm. The surface roughness of the glass treated with W40 boron carbide abrasive can reach 1.25~0.63um, the processed hard alloy can reach 0.63~0.32um, and the processed surface has no structural change, residual stress and burn.

3. The tool has small macroscopic force on the workpiece, small heat influence, can process thin wall, narrow slit and sheet workpiece, and can process various complex cavities and profiles as long as the workpiece is made into corresponding shapes and sizes.

 

Applications:

  • This machining is used to machine hard and brittle material like carbide, ceramic, glass etc.
  • This is used in machining of die and tool of drill, wire drawing machine etc.
  • Used in fabrication of silicon nitrite turbine blade.
  • It is used to cut diamond in desire shape.
  • It is used machining of machining non-conductive hard material which cannot be machined by ECM or EDM due to poor conductivity.

 

 

 

 

 

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