High Speed Wire Coil Embedding Ultrasonic Plastic Welding Machine with High Precise Uniform Spaces

High Speed Wire Coil Embedding Ultrasonic Plastic Welding Machine with High Precise Uniform Spaces

Brief Introduction:

Radio frequency identification (RFID) inlays are manufactured throughout the world for many purposes: biometric passports, the contactless smart card market (e-ID, electronic healthcare cards, payment cards, public transportation), and for dual interface applications. At the same time, wire-embedded high frequency (HF) RFID antennas are available and offer a number of advantages over printed, etched, or galvanized variations.

Among others, the ability to freely select shapes is enticing for card and passport manufacturers, since this can lead to competitive advantages. Further benefits, such as environmental friendliness, durability, and improved product quality, also should be mentioned.

Parameters:

Components and Parts

Generator

Booster

Converter

Welding Horn

Protective Sleeve (Nylon and Aluminum optional)

HF Cable

Power Cable

Benefits:

In the production of Bank card, smart card and VIP, which need to dip tin coils and then welding.

ultrasonic welder can welding wire directly, the welding spot has the following benefits:

1. welding spot firm, prevent to cold Weld.

2. same size welding spot, consistency.

3. welding spot small, easy to press fit package.

4. eliminating the need for pre-welded solder dip process,can hire less one operations staff.

5. its welding is faster than iron.

6. the production process will not produce exhaust gas waste pollution.

7. 70KHz ultrasonic unit, speed welding, low production costs.

8. Stable frequency of ultrasonic automatic planting line machine, and could adjust frequency according to customer requirements.

Compare with etching antenna technology:

Ultra-thin IC card is made possible by ultrasonic embedding process.It will effectively solve the problem of the failure of etching antenna technology in the application of ultra-thin IC card, which can reduce the scrap rate and reuse cost.The ultra-thin IC card produced by using the ultrasonic embedding process is the same as the IC card manufactured by the traditional process, so its average service life will be longer than the ultra-thin IC card produced by using the etching antenna (6 years) process. Two different processes, the material difference is mainly in the antenna part, the antenna material used in the etching antenna process is a PET (polyethylene terephthalate, PET) sheet with a thickness of 0.078 mm and a precision etched aluminum wire, and Ultrasound embedding process antenna for enameled copper wire, the same production performance of an IC card, according to the material price of etching antenna price is about 2 times the price of copper, so the use of ultrasonic embedding process to produce ultra-thin IC card The price is also slightly better. The mass production of ultra-thin IC CARDS will have a profound impact on the continuous development of the smart card industry.

EVEN MORE FREEDOM FOR ANTENNA EMBEDDING

Antenna layouts, which previously depended on the position of the chip, now can be produced and placed freely and independently. Production steps, such as cutting the antenna free for producing an electrically conductive connection between the module and antenna—as was previously required for the production of dual interface cards—are no longer necessary. Since the mechanical-electrical connection is no longer needed, the cards are much more durable.

THE CHALLENGES? QUALITY AND PRECISION!

The most basic prerequisite for the function of this technology is the embedding of the antennas with consistent quality and uniform frequency even when using 12 wire-embedding heads. Particularly when embedding antennas with very small winding distances, high precision is a must. In the future, mechanical engineers from the area of RFID inlay production will have to face this challenge in order to remain competitive on the market.

High Speed Wire Coil Embedding Ultrasonic Plastic Welding Machine with High Precise Uniform Spaces