Home Companies Shenzhen Tongyifang Optoelectronic Technology Co., Ltd.

Complete Assembly Drawings Printed Circuit Board Assembly Flex PCB Designs Of All Sorts

Shenzhen Tongyifang Optoelectronic Technology Co., Ltd.
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[China] country

Address: No.4 Building,XinLianHe Industrial Park JinCheng Road,Shajing Town Baoan District,Shenzhen China

Contact name:Tongyifang

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Shenzhen Tongyifang Optoelectronic Technology Co., Ltd.

Complete Assembly Drawings Printed Circuit Board Assembly Flex PCB Designs Of All Sorts

Country/Region china
City & Province shenzhen guangdong
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Product Details

PCB Assembly and PCBA Assembly, Printed Circuit Board Assembly

 

1. Details:

Item name: SMT Assembly PCBA PCBA 

Place of Origin: ShenZhen, China

Model: TYF PCBA

MOQ: 1000 piece

 

2. PCB Design & Layout

» Excellent Expertise in design tools: Allegro, Pads, and Mentor Expedition.
» High density SMT designs (BGA, uBGA, PCI, PCIE, CPCI…)
» Flex PCB designs of all sorts
» Complete assembly drawings
» In-Circuit Test data generation (ICT)
» Drill, panel and cutout drawings designed
» Professional fabrication documents created
» High-speed, multi-layer digital PCB designs- Bus routing, differential pairs, matched lengths; Fast PCB design in 2-3 days.
» Concentrate on the PCB design Wi-Fi Module, BLE Module, GPS Tracking application.RF Modules,Medical-Care devices,LED PCB Boards.
» We come up with the design as per customer requirement,and take care for the RAW material cost at the outset of design.
» Full control for the PCB design, from requirement, Schematic, PCB Layout, SI/PI/EMI inspection, we will locate the design issues in the inspection processing.

 

3. PCB Specifications
PCB layer1, 2, 4 or 6, up to 18 layers
Board shapeRectangular, round, slots, cutouts, complex, irregular
Board typeRigid, flexible, rigid-flexible
Board materialFR-4 glass epoxy, FR4 High Tg, RoHS compliant; Aluminum, Rogers, etc.
Board cuttingShear, V-score, tab-routed
Board thickness0.2 ~ 4.0 mm (±10%), Flex board: 0.01 ~ 0.25″ (±10%)
Copper weight1.0, 1.5, 2.0 Oz (tolerance ±0.25 oz)
Solder maskDouble-sided green LPI, Also support red, white, yellow, blue, black
Silk screenDouble-sided or single-sided in white,yellow, black, or negative
Silk screen min. line width0.006″ or 0.15mm
Max board dimension20 inch *20 inch or 500mm*500mm
Min. trace/gap0.10mm, or 4 mils
Min. drill hole diameter0.01”, 0.25mm, or 10 mils
Surface finishHASL, Nickle, Imm Gold, Imm Tin, Imm Silver, OSP etc.
Min.slot width0.12”, 3.0 mm, or 120 mils
V-score depth20-25% of board thickness
Plated through holesYes
Design file formatGerber RS274X, 274D, Eagle and AutoCAD’s, DXF, DWG, Protel 99se

 

 

4. PCB Assembly Center
Supported Assembly Capabilities
Different types of Assembly
THD (Thru-Hole Device)
SMT (Surface-Mount Technology)
SMT & THD combined
2-sided SMT and THD assembly
Order Volume Allowed
1 to 5,000 boards

Parts
Passives parts, smallest size 0201
Fine pitch to 8 Mils
BGA, uBGA, QFN, POP and Zero-Lead chips
Connectors and terminals
Component Package
Reels
Cut tape
Tube and tray
Loose parts and bulk
PCB Board Measurements
Minimum measurement: 0.2″ x 0.2″ (5mm x 5mm)
Largest dimension: 15″ x 20″ (381mm x 508mm)
Printed circuit board shapes
Oblong
Round
Slots and Cut outs
Complicated and Uncommon

PCB board kinds
Rigid FR-4 boards
Rigid-Flex boards
Assy procedures
Leaded process
ero-Lead (RoHS)
Design file formatting
Gerber RS-274X, 274D, Eagle as well as AutoCAD’s DXF, DWG
BOM (Bill of Materials) (.xls, .csv, . xlsx)
Centroid (Pick-N-Place Or XY file)
Testing Processes
Visual Inspection
X-ray Inspection
AOI (Also known as: Automated Optical Inspection)
ICT (AKA: In-Circuit Test)
Functional testing
Turnaround time periods
1 To 5 days for only printed circuit board assy
10 To16 days for full Turnkey Circuit Card Assy
 
5. Packaging

 

TYF Opto. LED modules products, packed in plastic Tray, according to different size, XX PCs each plastic Tray, as shown in the following. products without plastic box packed in bubble bags, in order to prevent the outside pressure, choose different bubble bag, according to the product size in each pack of XX products, packaged product will be stored in the form of carton and sealed, as shown in the following.

 

1) xx PCS LED module per Tray 4) Box information & packing

2)Tray stack and taping, XX LED module

trays and additional 1 dummy trays each up of

box. Add silica gel (1 each) on top of the tray

3) Sealing packing

 
 

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