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AM26C32IPWR Eletronic Integrated Circuits Rs-422 Interface IC Quad Diff Line Rcvr Receiver Electronic Chips

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Walton Electronics Co., Ltd.

AM26C32IPWR Eletronic Integrated Circuits Rs-422 Interface IC Quad Diff Line Rcvr Receiver Electronic Chips

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Product Details

AM26C32 Quadruple Differential Line Receiver

 

1 Features

 

• Meets or Exceeds the Requirements of ANSI TIA/EIA-422-B, TIA/EIA-423-B, and ITU Recommendation V.10 and V.11
• Low Power, ICC = 10 mA Typical

• ±7-V Common-Mode Range With ±200-mV Sensitivity
• Input Hysteresis: 60 mV Typical
• tpd = 17 ns Typical

• Operates From a Single 5-V Supply

• 3-State Outputs
• Input Fail-Safe Circuitry
• Improved Replacements for AM26LS32 Device
• Available in Q-Temp Automotive


2 Applications


• High-Reliability Automotive Applications
• Factory Automation
• ATM and Cash Counters
• Smart Grid
• AC and Servo Motor Drives

 

3 Description

 

The AM26C32 device is a quadruple differential line receiver for balanced or unbalanced digital data transmission. The enable function is common to all four receivers and offers a choice of active-high or active-low input.

The 3-state outputs permit connection directly to a busorganized system. Fail-safe design specifies that if the inputs are open, the outputs always are high.

The AM26C32 devices are manufactured using a BiCMOS process, which is a combination of bipolar and CMOS transistors. This process provides the high voltage and current of bipolar with the low power of CMOS to reduce the power consumption to about one-fifth that of the standard AM26LS32, while maintaining AC and DC performance.
Device Information(1)

 

 

Pin Functions

PIN

 

I/O

 

DESCRIPTION

NAME

LCCC

SOIC, PDIP, SO, TSSOP, CFP, or CDIP

1A

3

2

I

RS422/RS485 differential input (noninverting)

1B

2

1

I

RS422/RS485 differential input (inverting)

1Y

4

3

O

Logic level output

2A

8

6

I

RS422/RS485 differential input (noninverting)

2B

9

7

I

RS422/RS485 differential input (inverting)

2Y

7

5

O

Logic level output

3A

13

10

I

RS422/RS485 differential input (noninverting)

3B

12

9

I

RS422/RS485 differential input (inverting)

3Y

14

11

O

Logic level output

4A

18

14

I

RS422/RS485 differential input (noninverting)

4B

19

15

I

RS422/RS485 differential input (inverting)

4Y

17

13

O

Logic level output

G

5

4

I

Active-high select

G

15

12

I

Active-low select

GND

10

8

Ground

 

NC(1)

1

 

 

 

 

 

 

Do not connect

6

11

16

VCC

20

16

Power Supply

(1) NC – no internal connection.

 

Specifications

 

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
 MIN MAXUNIT
VCC Supply voltage(2)7V
VI Input voltageA or B inputs–11 14

 

V

G or G inputs–0.5 VCC + 0.5
VID Differential input voltage–14 14V
VO Output voltage–0.5 VCC + 0.5V
IO Output current±25mA
Tstg Storage temperature-65 150°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values, except differential voltages, are with respect to the network ground terminal.

 

 

4.1 ESD Ratings

 VALUEUNIT

 

V(ESD) Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±3000

 

V

Charged-device model (CDM), per JEDEC specification JESD22- C101(2)±2000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

 

4.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
 MINNOMMAXUNIT
VCCSupply voltage 4.555.5V
VIHHigh-level input voltage 2 VccV
VILLow-level input voltage 0 0.8V
VICCommon-mode input voltage -7 +7V
IOHHigh-level output current –6mA
IOLLow-level output current 6mA

 

 

TA

 

 

Operating free-air temperature

AM26C32C0 70

 

 

°C

AM26C32I–40 85
AM26C32Q–40 125
AM26C32M–55 125

 

4.3 Thermal Information

 

THERMAL METRIC(1)

AM26C32

 

UNIT

D (SOIC)N (PDIP)NS (SO)PW (TSSOP)
16 PINS16 PINS16 PINS16 PINS
RθJA Junction-to-ambient thermal resistance736764108°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

 

4.1 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYP(1)MAXUNIT
VIT+Differential input high-threshold voltage

VO = VOH(min), IOH = –440

µA

VIC = –7 V to 7 V0.2

 

V

VIC = 0 V to 5.5 V0.1
VIT–Differential input low-threshold voltageVO = 0.45 V, IOL = 8 mAVIC = –7 V to 7 V–0.2(2)

 

V

VIC = 0 V to 5.5 V–0.1(2)
VhysHysteresis voltage (VIT+ – VIT−) 60mV
VIKEnable input clamp voltageVCC = 4.5 V, II = –18 mA–1.5V
VOHHigh-level output voltageVID = 200 mV, IOH = –6 mA3.8V
VOLLow-level output voltageVID = –200 mV, IOL = 6 mA 0.20.3V
IOZOFF-state (high-impedance state) output currentVO = VCC or GND ±0.5±5µA
II

 

Line input current

VI = 10 V, Other input at 0 V1.5mA
VI = –10 V, Other input at 0 V–2.5mA
IIHHigh-level enable currentVI = 2.7 V20μA
IILLow-level enable currentVI = 0.4 V–100μA
riInput resistanceOne input to ground1217 
ICCQuiescent supply currentVCC = 5.5 V 1015mA

(1) All typical values are at VCC = 5 V, VIC = 0, and TA = 25°C.

(2) The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for common- mode input voltage.

 

4.1 Switching Characteristics

over operating free-air temperature range, CL = 50 pF (unless otherwise noted)

 

PARAMETER

 

TEST CONDITIONS

AM26C32C AM26C32IAM26C32Q AM26C32M

 

UNIT

MINTYP(1)MAXMINTYP(1)MAX
tPLHPropagation delay time, low- to high-level output

 

 

See Figure 2

9172791727ns
tPHLPropagation delay time, high- to low-level output9172791727ns
tTLHOutput transition time, low- to high-level output

 

 

See Figure 2

 49 410ns
tTHLOutput transition time, high- to low-level output 49 49ns
tPZHOutput enable time to high-level

 

See Figure 3

 1322 1322ns
tPZLOutput enable time to low-level 1322 1322ns
tPHZOutput disable time from high-level

 

See Figure 3

 1322 1326ns
tPLZOutput disable time from low-level 1322 1325ns

(1) All typical values are at VCC = 5 V, TA = 25°C.

 

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