4.5mm 4.0 W/MK heat sink thermal pad For RDRAM Memory Modules

Company Profile

With professional R&D capabilities and over 17 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Ziitek TIF1180N-40-10F​ thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

<Good thermal conductive
<Moldability for complex parts
<Soft and compressible for low stress applications

<cooling components to the chassis of frame

<High speed mass storage drives

<Heat Sinking Housing at LED-lit BLU in LCD

<LED TV and LED-lit lamps

<RDRAM memory modules

<Micro heat pipe thermal solutions

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.