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[China]
Trade Verify
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Contact name:Dana
Dongguan Ziitek Electronical Material and Technology Ltd. |
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Verified Suppliers
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Power semiconductors applied RoHS Compliant yellow thermal phase change pad pcm TIC 800Y
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
The TIC™800Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features
> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Typical Properties of TIC™800Y Series
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Product Name | TICTM803Y | TICTM805Y | TICTM808Y | TICTM810Y | Testing standards |
Color | Yellow | Yellow | Yellow | Yellow | Visual |
Composite Thickness | 0.003" (0.076mm) | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | |
Thickness Tolerance | ±0.0006" (±0.016mm) | ±0.0008" (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | |
Density | 2.2g/cc | Helium Pycnometer | |||
Work temperature | -25℃～125℃ | ||||
phase transition temperature | 50℃~60℃ | ||||
Thermal conductivity | 0.95 W/mK | ASTM D5470 (modified) | |||
Thermal lmpedance @ 50 psi(345 KPa) | 0.021℃-in²/W | 0.024℃-in²/W | 0.053℃-in²/W | 0.080℃-in²/W | ASTM D5470 (modified) |
0.14℃-cm²/W | 0.15℃-cm²/W | 0.34℃-cm²/W | 0.52℃-cm²/W | ||
Standard Thicknesses:
0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom
liner. TIC™800 series is available in kiss cut an extended pull tab
liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series
products.
Reinforcement:
No reinforcement is necessary.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
| Q: What's the thermal conductivity test method given on the data sheet ? | ||||||||
| A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. |
