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[China]
Trade Verify
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Contact name:Dana
Dongguan Ziitek Electronical Material and Technology Ltd. |
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Verified Suppliers
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White Fiberglass Adhesive Double Side Thermal Conductivity Tape for computer processor
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.
Our vast experience allows us to assist our customers best in thermal engineering field.
We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
The TIA™800FG Series products are mostly used for bonding heat dissipation fins,
microprocessors and other power consumption semiconductors. This
type of adhesive tape possesses ultimate bonding strength with low
thermal impedance, with which in effect can be able to replace the
method of lubricating grease and mechanical fixing.
TIA800FG Series Datasheet-(E)-REV01.pdf
Features
> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided
pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor
control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or
clip mounting
Typical Properties of TIA™800FG Series
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| Product Name | TIATM805FG | TIATM806FG | TIATM808FG | TIATM810FG | TIATM815FG | TIATM820FG | Test Method |
| Color | White | Visual | |||||
| Adhesive Type | Acrylic Adhesive | ******** | |||||
| Backing Type | Glass fiber | ******** | |||||
| Composite Thickness | 0.005" 0.127mm | 0.006" 0.152mm | 0.008" 0.203mm | 0.010" 0.254mm | 0.015" 0.381mm | 0.020" 0.508mm | ASTM D374 |
| Aluminum Foil Thickness | ±0.001" ±0.025mm | ±0.001" ±0.025mm | ±0.0012" ±0.03mm | ±0.0012" ±0.03mm | ±0.0015" ±0.038mm | ±0.002" ±0.05mm | ASTM D374 |
| Voltage Breakdown | > 2000 Vac | > 2000 Vac | > 2300 Vac | > 3000 Vac | > 3500 Vac | > 3500 Vac | ASTM D149 |
| Peel Adhesion | 1200 g/inch2 | JIS K02378 | |||||
| Holding Power 25℃/Days | > 120 kg/inch2 | JIS K023711 | |||||
| Holding Power 120℃/Hours | > 10 kg/inch2 | JIS K023711 | |||||
| Recommend Using Pressure | 10 psi | ******** | |||||
| Thermal Conductivity | 0.8 W/mK | ******** | |||||
| Thermal Impedance@50psi | 0.52℃-in²/W | 0.59℃-in²/W | 0.83℃-in²/W | 0.91℃-in²/W | 1.15℃-in²/W | 1.43℃-in²/W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm)
0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.
Reinforcement:
TIA™800 Series sheets are fiberglass reinforced.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
