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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Contact name:Dana
Dongguan Ziitek Electronical Material and Technology Ltd. |
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4.5W/mK thermal conductivity heat cured epoxy adhesive for bonding two parts of electronics
TIE™380-45 High Performance Thermal Conductivity Of The Epoxy Adhesive
Product Summary:
TIE™380-45 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength. TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.
Feature
> Good thermal conductivity: 4.5W/mK
> Good maneuverability andadhesion performance
> Low shrinkage
> Low viscosity, easy-to-gas emissions
> Good solvent resistance, water resistance
> Longer working hours
> Excellent resistance to thermal shock
Typical Properties of TIETM380-45
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| Chemical type | Epoxy | Test Method |
| Appearance uncured | Gray Paste | Visual |
| Appearance cured | Dull Gray Solid | Visual |
| Components | One Component | ***** |
| Heat Capacity | 0.7 l/g-K | ASTM C351 |
| Key Substrates | Metals, ceramics | ***** |
| Hardness | 92 Shore A | ASTM 2240 |
| Continuous Use Temp | -40 to 180℃ | ***** |
| Tensile strength Al/Al @25°C | >2900psi | ***** |
| Thermal Conductivity | 4.5 W/m-K | ASTM D5470 |
Application Features:TIE™380-45
Color Gray
Viscosity@25℃ 150,000 cPs
Specific Gravity@25℃ 2.2 g/cc
Shelf life @25℃° 10 Days
@0℃° 6 Months
(Storage methods and temperature will affect the shelf life)
Curing procedures:
Curing temperature Curing time
100℃° 4 Hours
125℃ 2 Hour
150℃ 30 Minutes
170℃ 5 Minutes
General package:
1kg/can
