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[China]
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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Contact name:Dana
Dongguan Ziitek Electronic Materials & Technology Ltd. |
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new developed silicone pads 94 V0 3.0 g/cc for Micro heat pipe thermal solutions
The TIF1140-30-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF100-30-11US-Series-Datasheet-.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:3.5mmT
>hardness:20±5 shore00
>Colour: gray
>Soft and compressible for low stress applications
>RoHS compliant
>UL recognized
Applications
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>CPU
>display card
>mainboard/mother board
>notebook
Typical Properties of TIF1140-30-11US Series | ||||
Color | gray | Visual | Composite Thickness | Thermal Impedance@10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific gravity | 3.0g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
| Thickness | 3.5mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 20±5 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
Outgassing(TML) | 0.35% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 1.0X1012 Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 3.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
FAQ
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
