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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
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Dongguan Ziitek Electronic Materials & Technology Ltd. |
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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W
The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™803Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
| No heat sink preheating required |
| Low thermal resistance |
| Ease of use for high volume manufacturing |
| High thixotropic index |
| Dry to the touch for pre-apply applications |
| High thermal reliability, minimal pump out |
| Re-flow compatible |
| Cost Effective |
| Used where electrical isolation is not required |
| Low volatility – less than 1% |
| Easy to handle in the manufacturing environment |
| Flows but doesn’t run like grease |
| Available in custom die-cut shapes, kiss-cut on rolls |
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
> Telecommunication
| Typical Properties of TIC™800Y Series | |||||
| Product Name | TICTM803Y | TICTM805Y | TICTM808Y | TICTM810Y | Testing standards |
| Color | Yellow | Yellow | Yellow | Yellow | Visual |
Composite Thickness
| 0.003" (0.076mm) | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | |
| Thickness Tolerance | ±0.0006" (±0.016mm) | ±0.0008" (±0.019mm) | ±0.0008" (±0.019mm) | ±0.0012" (±0.030mm) | |
| Density | 2.2g/cc | Helium Pycnometer | |||
| Work temperature | -25℃～125℃ | ||||
| phase transition temperature | 50℃~60℃ | ||||
| Thermal conductivity | 0.95 W/mK | ASTM D5470 (modified) | |||
| Thermal lmpedance @ 50 psi(345 KPa) | 0.021℃-in²/W | 0.024℃-in²/W | 0.053℃-in²/W | 0.080℃-in²/W | ASTM D5470 (modified) |
| 0.14℃-cm²/W | 0.15℃-cm²/W | 0.34℃-cm²/W | 0.52℃-cm²/W | ||
