Home Companies Dongguan Ziitek Electronic Materials & Technology Ltd.

0.304mm Thickness IGBT Heatsink Blue Thermal Adhesive Tape with Glass Fiber Backing Acrylic

Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Us

[China] country

Trade Verify

Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Contact name:Dana

Inquir Now

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Suppliers
  • Trust
    Seal
  • Verified
    Supplier
  • Credit
    Check
  • Capability
    Assessment

0.304mm Thickness IGBT Heatsink Blue Thermal Adhesive Tape with Glass Fiber Backing Acrylic

Country/Region china
City & Province dongguan guangdong
Categories Packaging Machinery
InquireNow

Product Details

0.304mm Thickness IGBT Heatsink Blue Thermal Adhesive Tape with Glass Fiber Backing Acrylic

 

The TIA™812 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

 

TIA800 Series Datasheet-(E)-REV01.pdf


Features

 

Thermal Conductivity 0.9W/mK.
High bond strength to a variety of surfaces
Double sided pressure sensitive adhesive tape.
High performance, thermally conductive acrylic adhesive
allow for good conformability to irregular surfaces and good electrical isolation
Easy Application
Eliminates need for external hardware (screws, clips, etc.)
Available with easy release tabs

 

Applications

 

Mount heat sink onto BGA graphic processor or drive processor.
Mount heat spreader onto power converter PCB or onto motor control PCB
Can be used instead of heat cure adhesive,screw mounting or clip mounting
Heat sink onto BGA graphic processor
Heat sink to computer processor
Heat sink onto drive processor
LED Power Supply
LED Controller
LED Lights
LED Ceilinglamp
Monitoring the Power Box
AD-DC Power Adapters
Rainproof LED Power Supply
Waterproof LED Power Supply
Piranha wroof and common lED module
LED module for Channelletters
SMD LED module
LED Flesible strip, LED bar
LED PanelLight

 

                                              Typical Properties of TIA™800 Series
Product Name TIA™812Test Method
ColorWhiteVisual
Construction
&Compostion
Ceramic filled silicone elastomer***
Composite Thickness0.012"/0.304mm ASTM D751
Specific Gravity2.2 g/ccASTM D297
Specific Gravity1 l/g-KASTM C351
Hardness50 Shore AASTM 2240
Tensile Strength     >600 psi ASTM D412
Continuous Use Temp(-58 to 356℉) / (-50 to 180℃)***
Electrical 
Dielectric Breakdown Voltage        >5000 VAC ASTM D149
Dielectric Constant5.5 MHzASTM D150
Volume Resistivity5.0X10" Ohm-meterASTM D257
Flame Rating94 V0equivalent UL
Thermal 
Thermal Conductivity0.9 W/m-KASTM D5470
Thermal lmpedance @50psi   1.23℃-in²/W ASTM D5471
 
 
Standard Thicknesses:

0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.

Standard Sizes:

10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.

Reinforcement:

TIA™800 Series sheets are fiberglass reinforced.
 

Hot Products

Light amber 1.8W Phase Changing materials High Thermal of K10 Thermally pad for Car Battery & Power ...
Notebook and Desktop PCs Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness Replace LairdT...
TIC808A Phase Changing Materials in High Frequency Microprocessors Company Profile Ziitek company is ...
0.95W/mK YELLOW Thermal Phase Changing Materials TIC™805Y with 0.024℃-in² / W The TIC™805Y Series is ...
Computer Serves Thermal Phase Changing Materials / Heat Sensitive Materials​ The TIC™808Y Series is ...
LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK​ The TIC™810Y Series ...