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LED Coating Sealant Thermal Adhesive Glue , Low Temperature DIY
Conductive Glue
TIS™ 680-10AB is a two-component, high thermal conductive, low temperature cured,
long pot life, fire resistant Silica encapsulant glue. It
is design for potting of capacitors and electrical devices.Their
flexibility and elasticity make them suited to the coating of the
very uneven surfaces. Heat can transmit to the metal housing or
dissipation plate from the separate elements or even the entire
PCB, which in effect enhances the efficiency and life-time of the
heat-generating electronic components.
TIS680-10AB.pdf
Features
> Good thermal conductive: 1.0W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
> To potting LED Lighting heat spreader and power-
driver.
> Ferrite cements; tip type LED; good cementation to
aromatic polyester
> Relay sealant; Good adhesion to rubber, ceramics,
PCB and plastics
> Power transformers and coils; Potting capacitors;
Potting of small electrical devices
> Adhesion to metal glass and plastic; LCD &
substrates adhesion; Coating and sealant; Coil ; IGBTS;
Transformer; Fire retardant
> Optical / medical component adhesive
| Typical Uncured Material TIS™ 680-10A (Resin) | |
| Color | White |
| Viscosity@25℃ Brookfield | 3,500 cPs |
| Specific Gravity | 1.45 g/cc |
| Shelf life @25℃ in sealed container | 12 months |
| TIS™ 680-10B (Hardener) | |
| Color | White |
| Viscosity@25℃ Brookfield | 3,500 cPs |
| Shelf life @25℃ in sealed container | 12 months n |
|
Mix Ratio (By weight) TIS™ 680-10A : TIS™ 680-15B = 100 : 100 | |
| Viscosity @25℃ | 3,500 cPs |
| Working pot life (250 g @25℃) | 30 min |
| Specific Gravity | 1.45 g/ccn |
| Cure Schedule | |
| Cure 3 hours at 25℃ | |
| Cure 20 min at 70℃ |
| Cured Properties | |
| Hardness @25℃ | 85 Shore D |
| Service temperature | -40℃ to +160℃ |
| Glass transition temperature Tg | 92℃ |
| Elongation | 4.50% |
| Coefficient of thermal expansion, / ℃ | 3.0 x 10-5 |
| Fire resistance UL | 94 V-0 |
| Moisture absorption % wt gain 24 hours water immersion @25℃ | < 0.1 |
| Thermal | |
| Thermal Conductivity | 1.0 W/m-K |
| Thermal Impedance @10psi | 0.36 ℃-in²/W |
| ELECTRICAL AS CURED | |
| Dielectric Strength | 400 volts / mil |
| Dielectric Constant | 4.2 MHz |
| Dissipation factor | 0.029 MHz |
| Volume resistivity, ohm-cm @ 25℃ | 3.0 X 1013 |
