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12 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Contact name:Dana

Dongguan Ziitek Electronic Materials & Technology Ltd.

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12 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

Country/Region	china
City & Province	dongguan guangdong
Categories	Other Computer Accessories

Product Details

12 W / MK Ultra Soft Thermal Gap Filler , Wireless Routers Heatsink Thermal Pad

The TIF850HP thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 12 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies size
> Thickness: 1.25mmT
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF850HP
Color	Gray	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.57
			20mils / 0.508 mm	0.71
Hardness(Shore00 Thickness ≥0.75mm)	40	ASTM D297	30mils / 0.762 mm	0.88
			40mils / 1.016 mm	0.96
Hardness(Shore00 Thickness ＜0.75mm)	65	ASTM C351	50mils / 1.270 mm	1.11
			60mils / 1.524 mm	1.26
Density(g/cm³)	3.55	ASTM 2240	70mils / 1.778 mm	1.39
			80mils / 2.032 mm	1.54
Thickness range	0.030''~0.200''	ASTM D412	90mils / 2.286 mm	1.66
			100mils / 2.540 mm	1.78
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	1.87
			120mils / 3.048 mm	1.99
Dielectric Breakdown Voltage	≥5500 VAC	ASTM D149	130mils / 3.302mm	2.12
			140mils / 3.556 mm	2.22
Dielectric Constant	4.5 MHz	ASTM D150	150mils / 3.810 mm	2.31
			160mils / 4.064 mm	2.41
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257	170mils / 4.318 mm	2.51
			180mils / 4.572 mm	2.58
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	2.64
			200mils / 5.080 mm	2.72
Thermal conductivity	12 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.