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[China]
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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Contact name:Dana
Dongguan Ziitek Electronic Materials & Technology Ltd. |
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1.5W / MK Cooling Thermal Conductive Silicon Gap Filler Rubber Pad 0.25mm T
The TIF110FG-15E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Thickness: 0.25 mmT
> Good thermal conductive: 1.5 W/mK
> Naturally tacky
> Soft and Compressible for low stress applications
> Available in varies hardness
Applications:
> RDRAM memory modules
> LED TV and LED-lit lamps
> High speed mass storage drives
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Heat Sinking Housing at LED-lit BLU in LCD
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF 110FG-15E | ||||
Color | pink | Visual | Composite Thickness | hermalImpedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.55 |
| 20mils / 0.508 mm | 0.82 | |||
Specific Gravity | 2.87 g/cc | ASTM D297 | 30mils / 0.762 mm | 1.01 |
40mils / 1.016 mm | 1.11 | |||
Heat Capacity | 1 l/g-K | ASTM C351 | 50mils / 1.270 mm | 1.27 |
60mils / 1.524 mm | 1.45 | |||
Hardness | 45 (Shore 00) | ASTM 2240 | 70mils / 1.778 mm | 1.61 |
80mils / 2.032 mm | 1.77 | |||
| Tensile Strength | 40 psi | ASTM D412 | 90mils / 2.286 mm | 1.91 |
100mils / 2.540 mm | 2.05 | |||
Continuos Use Temp | -50 to 200℃ | *** | 110mils / 2.794 mm | 2.16 |
120mils / 3.048 mm | 2.29 | |||
Dielectric Breakdown Voltage | >1500～>5500 VAC | ASTM D149 | 130mils / 3.302mm | 2.44 |
140mils / 3.556 mm | 2.56 | |||
Dielectric Constant | 5.5 MHz | ASTM D150 | 150mils / 3.810 mm | 2.67 |
160mils / 4.064 mm | 2.77 | |||
Volume Resistivity | 4.0X10" Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 2.89 |
180mils / 4.572 mm | 2.98 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 3.05 |
200mils / 5.080 mm | 3.14 | |||
Thermal conductivity | 1.5 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.
Company Profile:
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
