Hefei Jingpu Sensor Technology Co., Ltd |
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Disposable NTC Epoxy Medical Temperature Sensor For Body Cavity Temperature Measurement
Product Introduction:
This product is widely used to measure the body cavity temperature of human body after installing a catheter. The sensor probe is encapsulated in a plastic case. Its rated resistance value is 2.252KΩ or 10KΩ. The total length of the product is generally 0.3 ~ 0.65 meters, and the measurement tolerance is (25 ~ 45) ℃ ± 0.1 ℃.
Feature:
Disposable
High Measurement Accuracy: (25~45)℃±0.1℃
Application:
Compatible with monitors, suitable for emergency, ICU room, operating room, etc.
Continuous temperature monitoring for patients.
Product Structure&Dimension (Unit: mm):
Electrical Specification:
Item | Code | Test condition | Performance requirements | Unit |
(Rated resistance) | R25℃ | +25℃±0.02℃ | 2.252 or 10 | kΩ |
(B value) | B25/50 | +25℃±0.02℃, +50℃±0.02℃ | 3935 | K |
(Response time) | τ | 23℃(air)→44℃(water),≤±0.1℃ | ≤150 | S |
(Max.Energy Dissipation) | Pmax | In water(≤1.2mA),≤0.02℃ | Approx 50 | μW |
(Withstand voltage) | Hi-pot | AC750V 1mA 1s In still air | No break down | V |
(Operating Temp. Range) | OTR | In still air | 0~50 | ℃ |
Package: 1pcs/packing
Notice:
--Use of this product: temperature measurement and temperature control;
--Control the energy dissipation generated by the current flowing through the chip within the required range to avoid measurement tolerance caused by self-heating of components;
--When heating and shrinking the sleeve at the temperature sensing head, the air outlet of the welding torch should be more than 30mm away from the temperature sensing head, so as to avoid the resistance drift caused by the excessive thermal shock of the high temperature to the resistor body.
--Storage temperature is 0℃~50℃, humidity is 30%~80%RH; avoid storing it in corrosive gas or direct sunlight environment; after opening the package, it needs to be resealed and stored again.
--According to the structural characteristics of epoxy components, users should avoid the element encapsulation head from being subjected to excessive stretching and bending forces from the leads. If the leads need to be bent, the bending point or force point should be controlled at 6mm away from the encapsulation head, so as not to strain the chip and no resistance drifting or even open circuit, especially when the components are heated.
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