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Electrical Thin Film Multilayer Printed Circuit Board Pcb With 3M Adhesive
Quick Detail:
Name | FPCB | Material | Cu: 1 oz PI: 1 mil |
Color | Transparent,red,yellow, green,blue.Pink.,purple | Surface treatment | pure-tin plating |
Minimum hole dimension | 0.3mm | Chemical resistance | Meet IPC standard: |
Minimum linear width | 0.08mm | Minimum linear distance | 0.08mm |
External tolerance | +/-0.05mm | Welding resistance | 280 more than 10 seconds |
Peeling Strength | 1.2kg/cm2 | Heat resistance | -200 to +300 degrees C |
Surface resistivity | 1.0*1011 | Bandability: | Meet IPC standard |
Description:
The main technical indicators
1. Max size: single sided, double sided:600mm * 500mm Multi-layer:
400mm * 600mm
2. Processing thickness:0.2mm -4.0mm
3 Copper foil substrate thickness: 18μ(1/ 2OZ ),35μ( 1OZ ),70μ( 2OZ
)
4 Common material: FR-4 , CEM-3 , CEM-1,
Polytetrachloroethylene,FR-1(94V0,94HB)
5. Light copper,Nickel-plated,Gilded,HAL；Immersion
Gold,Antioxidant,HASL,Immersion Tin,etc.
Applications:
1. The mobile phone
Focuses on the flexible circuit board light weight and thin thickness. Can effectively save the volume of products, easy connection of the battery, microphone, and buttons and into one.
2. Computer and LCD screen
Use the one line configuration of flexible circuit boards, and thin thickness. The digital signal into the picture, through the LCD screen
3. CD player
Focuses on three dimensional assembly characteristics of flexible circuit boards and thin thickness. The huge CD to carry around
4. Disk drives
Regardless of the hard disk, or diskette, is very dependent on FPC high softness and thickness of the 0.1 mm slim, read data finish quickly. Either a PC or NOTEBOOK.
5. The latest applications
Hard disk drives (HDDS, hard disk drive) of suspended circuit (Su ensi. N cireuit) and the components of xe packaging board, etc
Specifications
Type | PCB | Application | Electronic Products |
Color | blue | Feature |
|
Machine Stiffness | Rigid | Lays
| Customized |
Material | PET /PC | I nsulation Material | Organic resin |
I nsulation layer thichness | General | Antiflaming Speciality | VO |
Processing Technic | Rolled foil | Reinforcing material | Glass fiber |
Insulating Resin | Polyimide resin | Export Markets | Global |
Process Capability
1. Drilling:The minimum diameter 0.1mm
2. Hole metallization:Minimum aperture 0.2mm,Thickness / aperture ratio 4:1
3. Wire width: Minimum:Gold plate 0.10mm, Tin plate0.1mm
4. Wire spacing: Minimum:Gold plate 0.10mm, Tin plate0.1mm
5. Gold plate: nickel layer thickness:≧2.5μ,Gold layer thickness: 0.05-0.1μm or according to customer requirements
6. HASL: tin layer thickness:≧2.5-5μ
7. Paneling: Line-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.15mm smallest form tolerance: ± 0.1mm
8. Socket chamfer: Angle: 30 degrees, 45 degrees, 60 degrees Depth: 1-3mm
9. V Cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth: thickness 2/3 Minimum size: 80mm * 80mm
