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SMT MACHINE YAMAHA YSM10 Pick And Place Machine

Shenzhen Wenzhan Electronic Technology Co., Ltd.

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SMT MACHINE YAMAHA YSM10 Pick And Place Machine

Country/Region china
Categories Cap Making Machinery Parts
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Product Details

Yamaha YSM10 full automatic pick and place machine 

The YAMAHA YSM10 pick and place machine is an advanced automated equipment used in the electronics manufacturing industry for high-speed and accurate placement of electronic components onto printed circuit boards (PCBs). It offers a range of functionality and features that enhance efficiency, precision, and productivity in the assembly process.

 

SpecificationsSmt Chip Mounter
Applicable PCBL 510 x W 460mm - L 50 x W 50mm* Option: Up to L610 mm available
Mounting capability46,000CPH (The Company's optimum conditions)
Applicable components03015-W 55 x L 100mm (divided recognition for over W 45mm), H: 15mm or less
Mounting accuracy±0.035 mm (±0.025 mm) Cpk≧1.0 (3σ)
Number of component typesSetting Plate : Max 96 types (8mm)Tray : 15 types (sATS 15 equipment)
Power supply3-phase AC 200/208/220/240/380/400/416 V ±10% 50/60 Hz
Air supply source0.45MPa or more, clean and dry state
External dimensionL 1,254 x W 1,440 x H 1,445mm (excluding protrusions)
Weight1,270kg

 

Specifiaction:

ModelYSM10YS12YS24
Applicable PCBL 510 x W 460mm - L 50 x W 50mmL510x~W460mm to L50x~W50mmL50mm x W50mm to L700mm x W460mm
Mounting Capability46,000CPH36,000CPH72,000CPH
Mounting Accuracy±0.035 mm (±0.025 mm) Cpk≧1.0 (3σ)+/-0.05mm/CHIP+/-0.05mm (μ + 3σ), +/-0.03mm (3σ)
Number of component types15 types (sATS 15 equipment, Max, JEDEC)120 types(Max, 8mm tape reel conversion)120 types (Max./8mm wide tape reel conversion)
Applicable components03015-W 55 x L 100mm, H: 15mm or less0402(Metric base) to □32*mm components0402 to 32x32mm max (Height 6.5mm or less)
External DimensionsL 1,254 x W 1,440 x H 1,445mmL 1,254 x W 1,440 x H 1,445mmL1,254x W1,687x H1,445mm
 
Functionality:
1. Component Placement: The YSM10 pick and place machine is designed to precisely place a wide range of electronic components onto PCBs. It utilizes robotic arms, vacuum nozzles, and vision systems to pick components from feeders or trays and accurately position them onto designated locations on the PCB. This feature ensures precise component alignment and placement, minimizing the risk of assembly errors.
2. High-Speed Placement: The machine is capable of high-speed component placement, maximizing production throughput and efficiency. It can achieve rapid pick-and-place operations, allowing for fast assembly of PCBs and meeting high-volume manufacturing requirements.
3. Component Compatibility: The YSM10 pick and place machine supports a broad range of electronic components, including surface mount devices (SMDs) such as resistors, capacitors, integrated circuits (ICs), and various package types. It can handle components of different sizes, shapes, and orientations, accommodating diverse assembly requirements.
4. Vision System Integration: The machine often incorporates vision systems for component alignment and inspection. The vision system uses cameras and image processing algorithms to precisely align components with solder pads on the PCB. It also allows for real-time inspection of component placement accuracy, ensuring quality control during the assembly process.
5. Multi-Head Placement: The YSM10 pick and place machine may feature multiple placement heads. This enables simultaneous placement of multiple components, further enhancing production speed and efficiency. The multi-head configuration allows for the assembly of complex PCBs with a high component density.
6. Programmable Control: The machine is equipped with programmable control systems. It allows operators to define and adjust placement parameters, such as pick-and-place positions, component orientation, and speed profiles. This flexibility enables customization to match specific PCB layouts and component requirements, optimizing placement accuracy and productivity.
 
Usage Range:
The YSM10 pick and place machine is used in various applications within the electronics manufacturing industry, including:
 
1. PCB Assembly: It serves as a key component in automated PCB assembly lines. The machine facilitates the precise placement of electronic components onto PCBs, ensuring efficient and accurate assembly processes.
2. High-Volume Production: The YSM10 pick and place machine is well-suited for high-volume production runs. Its high-speed placement capability and efficient handling of diverse components make it ideal for meeting large-scale manufacturing demands.
3. Surface Mount Technology (SMT) Assembly: The machine is commonly used in surface mount technology assembly processes. It efficiently handles SMD components and supports the assembly of complex PCBs with densely populated components, such as those found in consumer electronics, automotive, telecommunications, and other electronic devices.
4. Multi-Product Manufacturing: The YSM10 pick and place machine is suitable for multi-product manufacturing scenarios. It allows for quick changeovers between different PCB designs or product variants, enabling efficient production of diverse electronic assemblies.
5. High-Precision Applications: The machine is utilized in applications that require high placement accuracy, such as medical devices, aerospace electronics, or high-end consumer electronics. It ensures precise component alignment and placement, meeting the strict quality standards of these industries.
 
The YAMAHA YSM10 pick and place machine plays a vital role in the automated assembly of electronic components onto PCBs. It offers high-speed, accurate, and flexible placement capabilities, contributing to efficient production processes and ensuring high-quality electronic assemblies.

 

Main features of Smt Chip Mounter
1) YAMAHA Pick and Place Machine Speed increases of 25% or more on conventional models and achieving the world's fastest mounting capacity,Based on the ideal concept 1-head solution capable of handling a wide range of components while maintaining high speed without the need for head replacement, we introduced various technologies cultivated from upper model Z:LEX YSM20. By adopting the latest technology such as the same lightweight and compact universal type HM (High-Speed Multi) head as the upper model and the new generation servo system, increases of 25% or more are achieved compared with conventional machines (YS12) in the 1-Beam 1-Head machine class to realize a mounting capacity of the world's fastest at 46000 CPH (in the Company's optimum conditions) At the same time, it is versatile enough to handle from 03015 (0.3mm x 0.15mm) ultra-small chips to large components of 55mm x 100mm and 15mm in height.
In addition,YAMAHA Pick and Place Machine by improving the performance of the scan camera, we have expanded the range of component size compatibility for high-speed mounting from 8mm to 12mm.
2) Scalability for flexibly adjust to production site requirements
A range of options are available for selection including the sATS15, an automatic replacement type tray component supply device, the ANC, an auto nozzle station capable of automatically changing nozzles, the multi camera which recognizes components exceeding 6.5mm in height or over 12mm square in size at high speed and high precision.The tape feeder is supported by the electric intelligent feeder SS feeder and ZS feeder used in the YS series.
3) Enhanced functionality to provide for table production
Pickup and recognition errors are suppressed along with reduced loss in machine stoppage due the integration of the common functionalities of the top machines of the Z:TA-R YSM40R and the Z:LEX YSM20 with their e-Vision for automatically creating and tracking components data, Smart Recognition for easily creating components data from complicated shapes.

 

 

 

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