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[China]
Trade Verify
Address: HENGFENG INDUSTRIAL AREA,ZHOUSHI ROAD NO. 739,HEZHOU COMMUNITY,HANGCHENG STREET,BAOAN,SHENZHEN,CHINA
Contact name:Linda
Shenzhen Eton Automation Equipment Co., Ltd. |
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Verified Suppliers
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led light manufacturing machine line for led tube and strip with 180K CPH
The technical parameter of led tube and strip manufacturing machine line
| No. Of feeders station | 68 PCS |
| No. Of head | 34PCS |
| No. Of camera | 5 sets of digital camera |
| .PCB length width | Max:1200*330mm Min:100*100mm |
| PCB thickness | 0.5-5mm |
| PCB clamping | Adjustable pressure pneumatic |
| Mounting mode | Group picking and group placing |
| Feeding way | Electric feeder with double motor |
| software | R&D independently |
| Mounting height | ≤5mm |
| Power consumption | 6kw |
| X,Y,Z Axis drive way | High-end magnetic linear motor and servo motor |
| Electrical control | Independent research and development by ETON |
| Dimension | 2700*2300*1500mm |
| Weight | 1700kg |
| Power | 380AC 50HZ |
| Components | Led 3014/3528/3020/5050 and resistor, capacitor, bridge recitifiers etc. |
Production line of led tube and strip manufacturing machine line
Stencil Printing: solder paste is a follow-up material for the surface adhesive components and PCB to connect with each other. First, the steel plate is etched or laser cut, and then the solder paste is printed on the welding pad of PCB by the squeegee of the Printing machine, so as to enter the next step.
Component Placement: Component Placement is the key technology and work focus of the entire SMT process. The process USES highly precise automatic mounting equipment to accurately place the surface mount components on the solder pad of the printed PCB through computer programming.As the design of surface adhesive components is becoming more and more precise, the distance between the joints is becoming smaller, so the technical level difficulty of placement operation is increasing day by day.
Reflow Soldering: Reflow Soldering is to have been placed on the surface of adhesive components of the PCB, after Reflow furnace first preheating with activated flux, to raise its temperature to 217 ℃ melt solder paste, feet and PCB Soldering pad connected components, then after cooling, cooling, make the solder curing, surface adhesive components and PCB bonding is completed.
company profiles
ETON advanced technology and innovation drives the revolution of market rapidly ,and obtains a number of intellectual property technologies.and rated as “shenzhen high-tech enterprise” “china high-tech enterprise” “shenzhen top brand” “2015 LED technology innovation award” “the 4th China LED first innovation award”.
Package and delivery
Step 1: pack the machine with foam cotton and stretch film to protect the outside of the machine
Step 2: Vacuum packing. Put the desiccant in a vacuum bag to prevent moisture; use straps to secure the machine;
Step 3: professional wooden box packaging.
